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XM4C129DNCZADI2

Texas Instruments

XM4C129DNCZADI2 by Texas Instruments

XM4C129DNCZADI2 by Texas Instruments is a 32-bit microcontroller with 24-Ch 12-Bit ADC channels and 262144 bytes of RAM. It operates at a max clock frequency of 25 MHz, suitable for industrial applications requiring CAN, Ethernet, I2C, SPI, UART, USB connectivity. The package style is grid array with very thin profile and fine pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,837 parts In-Stock

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5,837

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Digiode

USA . 3,343 parts In-Stock

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3,343

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,229 parts In-Stock

1+ parts

$2.000

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-

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1,229

$2.000

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AZTECH Wire

Italy . 719 parts In-Stock

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$9.711

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719

$9.711

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Parana Technologies

USA . 1,316 parts In-Stock

1+ parts

$41.786

100+ parts

$3,880.418

1k+ parts

$37.607

10k+ parts

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1,316

$41.786

$3,880.418

$37.607

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DigiPath Technology Company

USA . 1,716 parts In-Stock

1+ parts

$46.011

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1,716

$46.011

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IDEA Electronic Components Group

UK . 2,377 parts In-Stock

1+ parts

$46.950

100+ parts

$44.602

1k+ parts

$42.255

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2,377

$46.950

$44.602

$42.255

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ChromeModa Solutions

Germany . 171 parts In-Stock

1+ parts

$46.950

100+ parts

$38.499

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171

$46.950

$38.499

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Corphita

USA . 3,583 parts In-Stock

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3,583

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Overview

Unlock the potential of your next project with the XM4C129DNCZADI2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that offer unmatched performance and reliability. Ideal for a wide range of applications, this microcontroller provides advanced features such as multiple ADC channels, DMA capabilities, and various connectivity options. With its high-speed operation and versatile peripherals, the XM4C129DNCZADI2 ensures seamless integration and enhanced functionality for your designs. Trust Texas Instruments to elevate your projects to new heights with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options.

Bit Size: 32

A bit size of 32 allows for handling of complex processes and data efficiently.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the microcontroller can perform reliably in diverse temperature conditions.

ROM Words: 1048576

Large ROM size allows for storing a significant amount of program data, enabling versatile functionality.

Width: 10 mm

Compact width size makes the microcontroller suitable for space-constrained applications.

ADC Channels: YES

Built-in ADC channels enable analog-to-digital conversion, expanding the range of applications the microcontroller can be used for.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions, enhancing overall performance.

Connectivity: CAN(2), ETHERNET, I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Multiple connectivity options enable seamless integration with various systems and devices.

Technical Specifications

Microcontrollers XM4C129DNCZADI2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B212

Length:

10 mm

No. of I/O Lines:

140

No. of Terminals:

212

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

262144

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET, I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(3), DMA(32), LCD, POR, PWM(8), RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

XM4C129DNCZADI2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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