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XM4C1294NCPDTI2

Texas Instruments

XM4C1294NCPDTI2 by Texas Instruments

XM4C1294NCPDTI2 by Texas Instruments is a 32-bit microcontroller with 128 terminals, operating at up to 25 MHz. It features ADC and DMA channels, suitable for industrial applications requiring high-speed processing and precise analog-to-digital conversion. With a wide temperature range of -40 to 85°C, it offers reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,545 parts In-Stock

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6,545

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Digiode

USA . 689 parts In-Stock

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689

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AZTECH Wire

Italy . 641 parts In-Stock

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$11.094

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641

$11.094

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One Stop Electronics

USA . 1,091 parts In-Stock

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$16.000

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1,091

$16.000

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Parana Technologies

USA . 2,082 parts In-Stock

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$34.172

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$143.958

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2,082

$34.172

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$143.958

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ChromeModa Solutions

Germany . 3,539 parts In-Stock

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$38.395

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$31.484

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3,539

$38.395

$31.484

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IDEA Electronic Components Group

UK . 2,232 parts In-Stock

1+ parts

$38.395

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$36.475

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$34.556

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2,232

$38.395

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$34.556

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Corphita

USA . 4,581 parts In-Stock

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4,581

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DigiPath Technology Company

USA . 125 parts In-Stock

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$34.617

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$34.617

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Overview

Empower your projects with the XM4C1294NCPDTI2 by Texas Instruments, a top-of-the-line microcontroller that offers unparalleled reliability and performance. Designed with precision and expertise, this microcontroller is perfect for a wide range of applications, ensuring seamless operation and efficiency. With its advanced features and cutting-edge technology, the XM4C1294NCPDTI2 provides unmatched value and benefits to customers looking to take their projects to the next level. Trust Texas Instruments to deliver quality and innovation in every product, making your projects stand out from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, cost-effective, and provides good protection for the microcontroller, making it durable for various applications.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and enabling efficient PCB layout designs.

Maximum Supply Voltage: 1.32 V

Provides a safe operating range for the microcontroller, ensuring reliable performance without risking damage from excessive voltage.

Package Shape: SQUARE

Square shape enables symmetrical placement on the PCB, simplifying the design and assembly process.

Bit Size: 32

Offers a high computational capability with a 32-bit processor, suitable for handling complex tasks and operations efficiently.

No. of Terminals: 128

Having a higher number of terminals allows for more connectivity options and functionality in the microcontroller.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

This package style offers a compact form factor with a thin profile and fine pitch, ideal for applications where space is limited.

Minimum Supply Voltage: 1.14 V

Ensures proper functionality even at low voltage levels, making the microcontroller efficient and versatile.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments or applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

Capable of operating in cold temperatures, making it suitable for a wide range of environments and applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and conductivity, ensuring reliable connections and long-term performance.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to interface with analog sensors or signals, expanding its capabilities for data acquisition.

DMA Channels: YES

Supports Direct Memory Access channels, enabling fast data transfer and processing, enhancing the efficiency of the microcontroller.

Terminal Position: QUAD

Quad terminal position enables easy mounting and soldering, contributing to simplified assembly processes.

Maximum Seated Height: 1.2 mm

Low profile design with a maximum seated height of 1.2 mm helps in reducing overall PCB thickness and saving space in compact designs.

Width: 14 mm

Compact width dimension allows for easy integration in tight spaces, adding versatility to the microcontroller's application range.

Maximum Clock Frequency: 25 MHz

High clock frequency capability of 25 MHz enables fast data processing and execution of tasks, making the microcontroller efficient for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand the peak reflow temperature for up to 30 seconds, ensuring proper soldering and assembly processes without compromising the microcontroller's integrity.

Peak Reflow Temperature °C: 260

Withstands peak reflow temperature of 260°C, allowing for reliable soldering and assembly procedures for robust performance.

Length: 14 mm

Compact length dimension offers flexibility in PCB layout design and helps in accommodating the microcontroller in space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making the microcontroller suitable for demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient data processing and low power consumption, making the microcontroller suitable for battery-operated devices or power-sensitive applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, contributing to the microcontroller's overall efficiency and reliability.

Terminal Form: GULL WING

Gull-wing terminal form enables easy soldering and excellent mechanical stability, enhancing the reliability of connections for long-term performance.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage of 1.2 V ensures consistent performance and efficient power usage in various applications.

PWM Channels: YES

Integrated PWM channels allow for precise control of analog signals or outputs, enhancing the microcontroller's versatility in diverse applications.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in software updates and storage, allowing for easy reprogramming of the microcontroller for optimized performance.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4 mm enables high-density mounting and compact PCB designs, ideal for miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller has intermediate moisture sensitivity, ensuring proper handling and storage procedures to maintain its reliability.

Speed: 120 rpm

Operating speed of 120 revolutions per minute ensures fast data processing and response times, making the microcontroller suitable for time-critical applications.

No. of I/O Lines: 90

Abundance of I/O lines (input/output) enables versatile connectivity and interfacing with external devices, expanding the microcontroller's functionality for diverse applications.

Technical Specifications

Microcontrollers XM4C1294NCPDTI2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XM4C1294NCPDTI2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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