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XM4C129ENCZADI1

Texas Instruments

XM4C129ENCZADI1 by Texas Instruments

Texas Instruments XM4C129ENCZADI1 microcontroller features 32-bit architecture, 24-Ch 12-Bit ADC, and 262144 bytes of RAM. Ideal for industrial applications with CAN, ETHERNET, USB connectivity options. Operates b/w -40 to 85 °C with a clock frequency of up to 25 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,130 parts In-Stock

1+ parts

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5,130

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Digiode

USA . 3,278 parts In-Stock

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3,278

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Distributors (Availability)

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One Stop Electronics

USA . 901 parts In-Stock

1+ parts

$17.000

100+ parts

-

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901

$17.000

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AZTECH Wire

Italy . 853 parts In-Stock

1+ parts

$18.114

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853

$18.114

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Parana Technologies

USA . 1,151 parts In-Stock

1+ parts

$34.645

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1,151

$34.645

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IDEA Electronic Components Group

UK . 2,361 parts In-Stock

1+ parts

$38.927

100+ parts

$36.981

1k+ parts

$35.034

10k+ parts

-

2,361

$38.927

$36.981

$35.034

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ChromeModa Solutions

Germany . 719 parts In-Stock

1+ parts

$38.927

100+ parts

$31.920

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719

$38.927

$31.920

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Microchip USA

USA . 2,117 parts In-Stock

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2,117

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Corphita

USA . 2,103 parts In-Stock

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2,103

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DigiPath Technology Company

USA . 90 parts In-Stock

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$35.097

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90

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$35.097

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Overview

Unlock limitless possibilities with the XM4C129ENCZADI1 microcontroller by Texas Instruments. Crafted with precision and cutting-edge technology, this versatile device is perfect for a wide range of applications. From industrial automation to consumer electronics, this high-quality product offers unparalleled performance and reliability. With a wide array of peripherals and advanced features, the XM4C129ENCZADI1 provides value and benefits that exceed expectations. Elevate your projects with the power and efficiency of Texas Instruments microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable for various applications.

Maximum Supply Voltage: 1.32 V

Higher supply voltage allows for efficient and stable performance of the microcontroller.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex computations and processing tasks efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures high-speed performance and efficient operation of the microcontroller.

RAM Bytes: 262144

Large RAM size enables the microcontroller to handle extensive data processing and multitasking effectively.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in challenging environmental conditions.

Connectivity: CAN(2), ETHERNET(2), I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Multiple connectivity options allow for seamless integration with a variety of devices and communication protocols.

Technical Specifications

Microcontrollers XM4C129ENCZADI1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B212

Length:

10 mm

No. of I/O Lines:

140

No. of Terminals:

212

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

262144

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(3), DMA(32), POR, PWM(8), RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

XM4C129ENCZADI1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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