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XM4C129ENCPDTI1

Texas Instruments

XM4C129ENCPDTI1 by Texas Instruments

XM4C129ENCPDTI1 microcontroller by Texas Instruments features a 32-bit architecture, 1048576 ROM words, and 262144 RAM bytes. With 20-Ch 12-Bit ADC channels, it is ideal for industrial applications requiring CAN, ETHERNET, I2C, SPI connectivity and up to 25 MHz clock frequency.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,372 parts In-Stock

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Digiode

USA . 3,903 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 697 parts In-Stock

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$14.855

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One Stop Electronics

USA . 192 parts In-Stock

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$25.000

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Parana Technologies

USA . 1,941 parts In-Stock

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$76.716

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DigiPath Technology Company

USA . 457 parts In-Stock

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$84.474

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$77.716

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457

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ChromeModa Solutions

Germany . 3,412 parts In-Stock

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$86.198

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$70.682

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$86.198

$70.682

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IDEA Electronic Components Group

UK . 1,802 parts In-Stock

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$86.198

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$81.888

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$77.578

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QUARKTWIN TECHNOLOGY LTD

USA . 25,371 parts In-Stock

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Corphita

USA . 2,724 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Experience the cutting-edge technology of the XM4C129ENCPDTI1 microcontroller by Texas Instruments, a leading manufacturer known for its high-quality products. This versatile device offers a wide range of applications in various industries, providing customers with unparalleled value and benefits. With advanced features like ADC channels, DMA channels, and a variety of peripherals, this microcontroller delivers exceptional performance and efficiency. Trust Texas Instruments to provide you with top-notch solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape is space-efficient and facilitates easy layout on a PCB.

Bit Size: 32

The 32-bit architecture provides high processing power and performance for complex tasks and calculations.

No. of Terminals: 128

A high number of terminals allow for versatile connectivity options and interfacing with external devices.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack style with thin profile and fine pitch design ensures efficient thermal dissipation and compact size for space-constrained designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage enables energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the product suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments.

ADC Channels: YES

The built-in ADC channels allow for analog signal acquisition and processing without the need for external components.

DMA Channels: YES

The presence of DMA channels enables efficient data transfer and reduces CPU load, improving overall system performance.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and provides a standardized interface for easy integration.

ROM Words: 1048576

The large ROM size allows for storing a significant amount of program code and data, accommodating complex applications.

Maximum Seated Height: 1.2 mm

The low maximum seated height minimizes the overall profile of the product, making it suitable for compact designs.

Width: 14 mm

The compact width enables space-efficient PCB placement and allows for densely populated designs.

Data EEPROM Size: 6K

The EEPROM size of 6K provides non-volatile memory for storing critical data, settings, and user information.

Peripherals: BOR, COMPARATOR(3), DMA(32), POR, PWM(8), RTC, TIMER(9), WDT(2)

The various peripherals including Brown-Out Reset, Comparators, DMA channels, PWM outputs, RTC, Timers, and WDT enhance the product's functionality and versatility for different applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency allows for fast and efficient processing of instructions and data, improving overall system performance.

Length: 14 mm

The compact length complements the overall dimensions of the product, making it suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture provides high computational efficiency and power optimization for embedded applications.

RAM Bytes: 262144

The substantial RAM size allows for efficient data storage and manipulation, supporting multitasking and data-intensive operations.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and reworking during PCB assembly, ensuring reliable electrical connections.

Analog To Digital Convertors: 20-Ch 12-Bit

The integrated ADC with 20 channels and 12-bit resolution allows for precise analog-to-digital conversions, suitable for sensor interfacing and data acquisition.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable power source for the product's operations, ensuring consistent performance.

PWM Channels: YES

The presence of PWM channels enables precise control of analog outputs such as motor speed, LED brightness, and audio volume.

Connectivity: CAN(2), ETHERNET(2), I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

The extensive connectivity options including CAN, Ethernet, I2C, IRDA, QEI, SPI, SSI, UART, and USB enhance communication capabilities and interoperability with external devices or networks.

ROM Programmability: FLASH

The use of flash memory for ROM programmability allows for flexible firmware updates, faster programming, and reliable non-volatile storage.

Terminal Pitch: 0.4 mm

The small terminal pitch facilitates high-density PCB layouts, enabling more functionality in a limited space.

Speed: 120 rpm

The speed of 120 rpm ensures timely execution of tasks and operations, suitable for applications requiring precise timing and control.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits allows for efficient instruction fetching and decoding, enhancing the overall processing speed.

No. of I/O Lines: 90

The high number of I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, offering flexibility in system design.

Technical Specifications

Microcontrollers XM4C129ENCPDTI1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Bytes:

262144

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(3), DMA(32), POR, PWM(8), RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Trade Compliance

XM4C129ENCPDTI1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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