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XM4C129ENCZADI2

Texas Instruments

XM4C129ENCZADI2 by Texas Instruments

XM4C129ENCZADI2 by Texas Instruments is a 32-bit microcontroller with 24-Ch 12-Bit ADC channels, 262144 bytes of RAM, and 8 PWM channels. It is suitable for industrial applications requiring CAN, Ethernet, I2C, SPI connectivity and operates at a max clock frequency of 25 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,460 parts In-Stock

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3,460

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Vyrian

USA . 2,708 parts In-Stock

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2,708

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 525 parts In-Stock

1+ parts

$9.679

100+ parts

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525

$9.679

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One Stop Electronics

USA . 1,649 parts In-Stock

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$12.000

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1,649

$12.000

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Parana Technologies

USA . 1,186 parts In-Stock

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$29.199

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$56.712

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1,186

$29.199

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$56.712

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DigiPath Technology Company

USA . 1,047 parts In-Stock

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$32.152

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1,047

$32.152

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ChromeModa Solutions

Germany . 2,524 parts In-Stock

1+ parts

$32.808

100+ parts

$26.903

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2,524

$32.808

$26.903

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IDEA Electronic Components Group

UK . 564 parts In-Stock

1+ parts

$32.808

100+ parts

$31.168

1k+ parts

$29.527

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564

$32.808

$31.168

$29.527

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Corphita

USA . 2,133 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the XM4C129ENCZADI2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are ideal for a wide range of applications. From industrial automation to consumer electronics, this product offers unmatched performance and reliability. With advanced features like multiple ADC and DMA channels, along with a variety of connectivity options, customers can expect seamless integration and enhanced functionality. Invest in the XM4C129ENCZADI2 and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the inner components of the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power input, accommodating a wider range of power sources.

ROM Words: 1048576

Large ROM capacity allows for storing a significant amount of program data and instructions, enabling complex functionalities.

ADC Channels: YES

Analog to Digital Convertors enable the microcontroller to read and interpret analog signals, expanding its range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances the efficiency and speed of processing, making the microcontroller ideal for high-performance applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the energy efficiency and reliability of the microcontroller.

Connectivity: CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Multiple connectivity options provide versatility for interfacing with various external devices and communication protocols.

Technical Specifications

Microcontrollers XM4C129ENCZADI2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B212

Length:

10 mm

No. of I/O Lines:

140

No. of Terminals:

212

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

262144

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

XM4C129ENCZADI2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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