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XM4C1292NCPDTI2

Texas Instruments

XM4C1292NCPDTI2 by Texas Instruments

XM4C1292NCPDTI2 by Texas Instruments is a 32-bit microcontroller with 128 terminals, 1048576 ROM words, and 262144 RAM bytes. It features 20-Ch 12-Bit ADCs, CAN, Ethernet, USB connectivity, and supports various peripherals like PWM and DMA. Ideal for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,325 parts In-Stock

1+ parts

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2,325

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Digiode

USA . 1,681 parts In-Stock

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1,681

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 436 parts In-Stock

1+ parts

$8.000

100+ parts

-

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436

$8.000

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AZTECH Wire

Italy . 283 parts In-Stock

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$16.737

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283

$16.737

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Parana Technologies

USA . 462 parts In-Stock

1+ parts

$27.159

100+ parts

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$32.791

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462

$27.159

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$32.791

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ChromeModa Solutions

Germany . 2,720 parts In-Stock

1+ parts

$30.516

100+ parts

$25.023

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2,720

$30.516

$25.023

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IDEA Electronic Components Group

UK . 86 parts In-Stock

1+ parts

$30.516

100+ parts

$28.990

1k+ parts

$27.464

10k+ parts

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86

$30.516

$28.990

$27.464

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Component Stockers USA

USA . 377 parts In-Stock

1+ parts

$99.990

100+ parts

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377

$99.990

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DigiPath Technology Company

USA . 1,724 parts In-Stock

1+ parts

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$27.513

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1,724

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$27.513

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Corphita

USA . 1,019 parts In-Stock

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1,019

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Microchip USA

USA . 184 parts In-Stock

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184

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Overview

Unlock the power of cutting-edge technology with the XM4C1292NCPDTI2 microcontroller by Texas Instruments. Delve into a world of endless possibilities with this top-of-the-line product that offers unparalleled performance and reliability. Perfect for a wide range of applications, this microcontroller boasts advanced features such as ADC channels, DMA channels, PWM capabilities, and more. Experience seamless connectivity with CAN, ETHERNET, I2C, SPI, UART, USB, and other interfaces. Trust in Texas Instruments' reputation for excellence and innovation, and elevate your projects to new heights with the XM4C1292NCPDTI2 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a lightweight and durable packaging for the microcontroller.

Bit Size: 32

A 32-bit architecture allows for higher processing power and more advanced applications to be run on the microcontroller.

ADC Channels: YES

Analog to Digital Converters allow for reading analog signals, making this microcontroller suitable for sensor interfacing and data acquisition applications.

ROM Words: 1048576

Large ROM capacity allows for storing a significant amount of program code and data on the microcontroller.

RAM Bytes: 262144

Ample RAM capacity enables efficient data processing and manipulation on the microcontroller.

Maximum Clock Frequency: 25 MHz

Higher clock frequency allows for faster processing speed and better performance in real-time applications.

Connectivity: CAN(2), ETHERNET, I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Wide range of connectivity options make this microcontroller versatile and suitable for communication with various external devices and peripherals.

Technical Specifications

Microcontrollers XM4C1292NCPDTI2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

98

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET, I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(3), DMA(32), POR, PWM(8), RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Trade Compliance

XM4C1292NCPDTI2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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