Loading...

XM4C129DNCZADI1

Texas Instruments

XM4C129DNCZADI1 by Texas Instruments

XM4C129DNCZADI1 microcontroller by Texas Instruments features a 32-bit architecture, 24-Ch 12-Bit ADC channels, and 262144 bytes of RAM. Ideal for industrial applications requiring high-speed processing, it offers connectivity options such as CAN, ETHERNET, and USB along with on-chip Flash ROM programmability. With a max clock frequency of 25 MHz and a wide range of peripherals including timers and PWM channels, this microcontroller is suitable for demanding tasks in various industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,909 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,909

-

-

-

-

Digiode

USA . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90

-

-

-

-

Holdelec - ElecDif-Pro

France . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 306 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

306

$2.000

-

-

-

AZTECH Wire

Italy . 576 parts In-Stock

1+ parts

$5.611

100+ parts

-

1k+ parts

-

10k+ parts

-

576

$5.611

-

-

-

Parana Technologies

USA . 2,155 parts In-Stock

1+ parts

$28.583

100+ parts

-

1k+ parts

$49.190

10k+ parts

-

2,155

$28.583

-

$49.190

-

DigiPath Technology Company

USA . 390 parts In-Stock

1+ parts

$31.474

100+ parts

$28.956

1k+ parts

-

10k+ parts

-

390

$31.474

$28.956

-

-

ChromeModa Solutions

Germany . 1,130 parts In-Stock

1+ parts

$32.116

100+ parts

$26.335

1k+ parts

-

10k+ parts

-

1,130

$32.116

$26.335

-

-

IDEA Electronic Components Group

UK . 1,038 parts In-Stock

1+ parts

$32.116

100+ parts

$30.510

1k+ parts

$28.904

10k+ parts

-

1,038

$32.116

$30.510

$28.904

-

Corphita

USA . 1,683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

-

-

-

-

Microchip USA

USA . 288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

288

-

-

-

-

Perfect Parts

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Overview

Experience unparalleled performance and reliability with the XM4C129DNCZADI1 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers cutting-edge solutions for a wide range of applications. Whether you're working on IoT devices, industrial automation, or automotive systems, this microcontroller offers unmatched versatility and efficiency. With advanced features like multiple ADC and DMA channels, along with a wide array of connectivity options, you can bring your projects to life with ease. Trust Texas Instruments for quality and innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package, ensuring long-term performance.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.32 V

Provides a higher supply voltage tolerance for flexibility in power requirements.

Package Shape: SQUARE

Compact shape that saves space on the PCB.

Bit Size: 32

Offers a high processing capability with a 32-bit architecture.

No. of Terminals: 212

Plenty of terminals for connectivity options and interfacing with other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Advanced package design for optimized space usage and performance.

Minimum Supply Voltage: 1.14 V

Allows for operation at lower voltage levels for energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with a high operating temperature range.

Minimum Operating Temperature: -40 °C

Performs reliably even in extreme low-temperature environments.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling sensor interfacing and data acquisition.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer without CPU intervention.

Terminal Position: BOTTOM

Facilitates easy PCB layout and assembly.

ROM Words: 1048576

Large memory capacity for program storage and data handling.

Maximum Seated Height: 1 mm

Low profile design for compact and slim electronic devices.

Width: 10 mm

Small form factor for space-constrained applications.

Data EEPROM Size: 6K

Additional non-volatile memory for storing critical data and parameters.

Peripherals: BOR, COMPARATOR(3), DMA(32), POR, PWM(8), RTC, TIMER(9), WDT(2)

Wide range of integrated peripherals for enhanced functionality and versatility.

Maximum Clock Frequency: 25 MHz

High clock speed for rapid processing and responsiveness.

Length: 10 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with reliable performance under harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient execution of instructions and high performance.

RAM Bytes: 262144

Generous RAM capacity for data storage and manipulation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable electrical connections and easy soldering.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple high-resolution ADC channels for precise analog signal processing.

Nominal Supply Voltage: 1.2 V

Standard voltage level for compatibility and ease of power supply design.

PWM Channels: YES

Pulse Width Modulation channels for precise control of signals and power.

Connectivity: CAN(2), ETHERNET, I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Versatile connectivity options for interfacing with a wide range of devices and networks.

ROM Programmability: FLASH

Flash memory technology for reprogrammable and flexible firmware updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density packaging and layout efficiency.

Speed: 120 rpm

Fast processing speed for quick response and real-time applications.

On Chip Program ROM Width: 8

Wide program ROM width for storage and execution of instructions.

No. of I/O Lines: 140

Abundance of I/O lines for versatile interfacing and external connectivity.

Technical Specifications

Microcontrollers XM4C129DNCZADI1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B212

Length:

10 mm

No. of I/O Lines:

140

No. of Terminals:

212

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

262144

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET, I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(3), DMA(32), POR, PWM(8), RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

XM4C129DNCZADI1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 12