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XM4C129DNCPDTI1

Texas Instruments

XM4C129DNCPDTI1 by Texas Instruments

XM4C129DNCPDTI1 by Texas Instruments is a 32-bit microcontroller with 1048576 ROM words and 262144 RAM bytes. It features 20-Ch 12-Bit ADC channels, 8 PWM channels, and connectivity options like CAN, ETHERNET, I2C, SPI, UART, and USB. Ideal for industrial applications requiring high-speed processing and extensive peripheral support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,815 parts In-Stock

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Digiode

USA . 4,907 parts In-Stock

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4,907

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Distributors (Availability)

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AZTECH Wire

Italy . 413 parts In-Stock

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$15.212

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413

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One Stop Electronics

USA . 966 parts In-Stock

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$35.000

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966

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Parana Technologies

USA . 1,777 parts In-Stock

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$67.017

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ChromeModa Solutions

Germany . 2,950 parts In-Stock

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$75.300

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$61.746

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2,950

$75.300

$61.746

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IDEA Electronic Components Group

UK . 1,228 parts In-Stock

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$75.300

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$71.535

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$67.770

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1,228

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$67.770

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QUARKTWIN TECHNOLOGY LTD

USA . 11,670 parts In-Stock

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Corphita

USA . 3,275 parts In-Stock

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DigiPath Technology Company

USA . 1,279 parts In-Stock

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$67.890

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Microchip USA

USA . 1,256 parts In-Stock

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Metaverse IC Inc.

Canada . 228 parts In-Stock

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Overview

Unlock the power of innovation with the XM4C129DNCPDTI1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality microcontrollers that are versatile and reliable. Perfect for a wide range of applications, this microcontroller offers customers unmatched value, benefits, and advantages. Whether you're looking to enhance automation, improve connectivity, or optimize performance, the XM4C129DNCPDTI1 is the perfect solution for your next project. Experience the difference with Texas Instruments and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, suitable for various applications.

Maximum Supply Voltage: 1.32 V

Allows for stable performance within the specified voltage range.

Bit Size: 32

Offers high computing power and capability for complex tasks.

No. of Terminals: 128

Provides a sufficient number of terminals for connectivity and interfacing with other devices.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and devices.

DMA Channels: YES

Supports direct memory access for efficient data transfer without CPU intervention.

ROM Words: 1048576

Provides ample memory space for program storage and data handling.

Maximum Clock Frequency: 25 MHz

Enables high-speed processing and responsiveness in real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for optimized performance and efficiency.

RAM Bytes: 262144

Offers a large amount of random access memory for temporary data storage and efficient multitasking.

Connectivity: CAN(2), ETHERNET, I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Supports a wide range of communication interfaces for seamless connectivity with different devices and networks.

Technical Specifications

Microcontrollers XM4C129DNCPDTI1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

No. of I/O Lines:

98

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Bytes:

262144

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET, I2C(10), IRDA, QEI, SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(3), DMA(32), POR, PWM(8), RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Trade Compliance

XM4C129DNCPDTI1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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