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XM4C129XNCZADI2

Texas Instruments

XM4C129XNCZADI2 by Texas Instruments

XM4C129XNCZADI2 by Texas Instruments is a 32-bit microcontroller with 212 terminals, operating at up to 25 MHz. It features ADC and DMA channels, suitable for industrial applications requiring high-speed processing and precise analog-to-digital conversion. With a wide temperature range of -40 to 85°C, it offers reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,913 parts In-Stock

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2,913

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Digiode

USA . 242 parts In-Stock

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242

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PC Components Company LLC

USA . 10 parts In-Stock

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10

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Bristol Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 436 parts In-Stock

1+ parts

$6.860

100+ parts

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436

$6.860

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One Stop Electronics

USA . 172 parts In-Stock

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$33.000

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172

$33.000

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Parana Technologies

USA . 100 parts In-Stock

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$57.923

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100

$57.923

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DigiPath Technology Company

USA . 1,999 parts In-Stock

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$63.780

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$58.678

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$63.780

$58.678

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IDEA Electronic Components Group

UK . 1,245 parts In-Stock

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$65.082

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$61.828

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$58.574

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1,245

$65.082

$61.828

$58.574

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ChromeModa Solutions

Germany . 631 parts In-Stock

1+ parts

$65.082

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$53.367

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631

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Corphita

USA . 1,773 parts In-Stock

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1,773

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Overview

Experience the power of innovation with the XM4C129XNCZADI2 by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers top-quality products that provide unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller offers advanced features such as ADC and DMA channels, PWM capabilities, and ROM programmability. With a compact design and industrial-grade temperature tolerance, the XM4C129XNCZADI2 is the perfect solution for your project needs. Trust Texas Instruments to bring value, benefits, and cutting-edge technology to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount capability makes it easier to integrate the microcontroller onto PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 1.32 V

Operating within a maximum supply voltage of 1.32V ensures safe and stable performance of the microcontroller.

Package Shape: SQUARE

Square package shape allows for efficient placement and layout on the PCB, optimizing space utilization.

Bit Size: 32

32-bit architecture provides enhanced processing power and data handling capabilities for the microcontroller.

No. of Terminals: 212

A high number of terminals enable connectivity to a wide range of external components and peripherals, increasing versatility of the microcontroller.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package with thin profile and fine pitch allows for high density packaging, enabling more functionalities in a compact form factor.

Minimum Supply Voltage: 1.14 V

Operating within a minimum supply voltage of 1.14V ensures energy efficiency and reliable performance of the microcontroller.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C makes the microcontroller suitable for industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures the microcontroller can function in extreme cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

Terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

ADC Channels: YES

Integrated ADC channels allow the microcontroller to convert analog signals to digital data, enabling sensor interfacing and analog input processing.

DMA Channels: YES

Availability of DMA channels helps in efficient data transfer between memory and peripherals, reducing CPU overhead and improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making it easier to design compact and efficient electronic systems.

Maximum Seated Height: 1 mm

Low maximum seated height allows for low-profile mounting of the microcontroller, saving space and enabling compact device designs.

Width: 10 mm

Compact width of 10mm makes the microcontroller suitable for applications where space constraints are a concern.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency of 25MHz enables fast data processing and real-time operation of the microcontroller.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds at peak temperature of 260°C ensures safe and reliable soldering of the microcontroller during manufacturing process.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for lead-free soldering, meeting environmental regulations and industry standards.

Length: 10 mm

Compact length of 10mm enables space-efficient placement of the microcontroller on the PCB, contributing to overall size reduction of the electronic system.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation of the microcontroller in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance and low power consumption, making it ideal for battery-operated and embedded applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, enhancing the overall efficiency and reliability of the microcontroller.

Terminal Form: BALL

Ball terminal form eases soldering process and ensures reliable electrical connections, improving the overall durability and performance of the microcontroller.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage of 1.2V ensures consistent and reliable operation of the microcontroller across varying load conditions.

PWM Channels: YES

Integrated PWM channels enable precise control of analog outputs such as motor speed, LED brightness, and audio volume, enhancing the flexibility and functionality of the microcontroller.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization of the microcontroller, ensuring adaptability to changing requirements and future enhancements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm facilitates high-density mounting on the PCB, enabling compact design and efficient use of board space.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the handling and storage requirements for the microcontroller during manufacturing and assembly processes to prevent damage due to moisture absorption.

Speed: 120 rpm

High speed of 120 revolutions per minute (rpm) allows for fast data processing and response times, making the microcontroller suitable for real-time applications and high-speed control systems.

No. of I/O Lines: 140

A high number of I/O lines provide ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility and functionality of the microcontroller.

Technical Specifications

Microcontrollers XM4C129XNCZADI2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

140

No. of Terminals:

212

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

XM4C129XNCZADI2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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