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TSB12LV26PZT

Texas Instruments

TSB12LV26PZT by Texas Instruments

TSB12LV26PZT by Texas Instruments is a 100-terminal bus controller with a data transfer rate of 132 MBps. Operating b/w 0-70°C, it supports IEEE 1394 drive interface standard and CMOS technology. Ideal for PCI applications, this thin-profile flatpack chip has a terminal pitch of 0.5 mm and operates at a nominal voltage of 3.3 V.

Median Price

$8.438

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,945 parts In-Stock

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$8.659

100+ parts

$7.059

1k+ parts

$4.706

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3,945

$8.659

$7.059

$4.706

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Mouser Electronics

USA . 23 parts In-Stock

1+ parts

$13.740

100+ parts

$8.830

1k+ parts

$8.380

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23

$13.740

$8.830

$8.380

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Rochester

USA . 8,041 parts In-Stock

1+ parts

-

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$6.750

1k+ parts

$6.040

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$5.690

8,041

-

$6.750

$6.040

$5.690

DigiKey

USA . 8,041 parts In-Stock

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$8.890

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$8.890

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Verical

USA . 8,035 parts In-Stock

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$8.438

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$7.550

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$7.112

8,035

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$7.112

Arrow

USA . 180 parts In-Stock

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$5.463

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$5.463

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Chip1Stop

Japan . 90 parts In-Stock

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$8.138

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90

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$8.138

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Distributors (In-Stock)

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Vyrian

USA . 3,105 parts In-Stock

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$5.463

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3,105

$5.463

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Digiode

USA . 1,956 parts In-Stock

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$6.213

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1,956

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Electronics Depot

USA . 120 parts In-Stock

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120

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North Shore Components

USA . 100 parts In-Stock

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100

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ComSIT Distribution GmbH

Germany . 91 parts In-Stock

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ComSIT USA

USA . 91 parts In-Stock

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Legend Electronics Inc.

USA . 42 parts In-Stock

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Prism Electronics

USA . 12 parts In-Stock

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Lantek

USA . 10 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 9 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Bristol Electronics

USA . 4 parts In-Stock

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Atlantic Semiconductor

USA . 4 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,749 parts In-Stock

1+ parts

$5.886

100+ parts

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3,749

$5.886

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Component Stockers USA

USA . 19,004 parts In-Stock

1+ parts

$6.650

100+ parts

$5.020

1k+ parts

$5.660

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19,004

$6.650

$5.020

$5.660

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Vigor

Singapore . 8,196 parts In-Stock

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$6.970

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$6.970

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Parana Technologies

USA . 1,161 parts In-Stock

1+ parts

$43.786

100+ parts

$4,066.215

1k+ parts

$39.408

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1,161

$43.786

$4,066.215

$39.408

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DigiPath Technology Company

USA . 1,971 parts In-Stock

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$48.214

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$48.214

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ChromeModa Solutions

Germany . 2,612 parts In-Stock

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$49.198

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$40.342

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IDEA Electronic Components Group

UK . 210 parts In-Stock

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$49.198

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$46.738

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$44.278

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210

$49.198

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Corohmni

South Africa . 129 parts In-Stock

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$67.461

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A-Z Elektronik GmbH

Germany . 5,523 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 1,620 parts In-Stock

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Perfect Parts

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Revolutionize your data transfer capabilities with the TSB12LV26PZT from Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality bus controllers like this one that offer unparalleled performance and reliability. With a maximum data transfer rate of 132 MBps and a wide operating temperature range, this product is perfect for various applications in the technology sector. Upgrade your systems today and experience the value, benefits, and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it resistant to impact and environmental factors.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product, reducing manufacturing costs and improving overall product quality.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of systems, providing flexibility and versatility in usage.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on circuit boards, making it ideal for compact and dense electronic designs.

No. of Terminals: 100

Having a high number of terminals allows for multiple connections and functionalities, enabling the product to support various components and peripherals.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and helps in reducing energy costs during operation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures stability and reliability of the product even under extreme environmental conditions.

Maximum Data Transfer Rate: 132 MBps

The high data transfer rate enables fast and efficient communication between devices, improving overall system performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function effectively in cold environments without any performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the connections.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections, reducing the risk of signal interference or disconnection during operation.

Maximum Seated Height: 1.2 mm

The low maximum seated height minimizes the overall profile of the product, making it suitable for space-constrained applications.

Width: 14 mm

The compact width of the product allows for efficient board layout and integration, enabling easy installation in various electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures safe and reliable soldering during assembly, preventing damage to the components.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for effective soldering of the product, ensuring strong and durable connections.

Length: 14 mm

The compact length of the product enables easy placement on circuit boards, saving space and allowing for efficient system design.

Temperature Grade: COMMERCIAL

Being a commercial-grade product, it is suitable for a wide range of applications in commercial electronic devices, ensuring compatibility and reliability.

Peripheral IC Type: BUS CONTROLLER, PCI

The bus controller PCI peripheral IC type provides robust control and management capabilities, enhancing the functionality and performance of the overall system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for extended use.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and secure connections, ensuring long-term durability and stability of the product.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable and consistent power delivery to the product, enhancing its overall performance and functionality.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting of components on circuit boards, optimizing space utilization and improving system efficiency.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates that the product can withstand moderate exposure to moisture during handling and storage, ensuring long-term reliability.

Drive Interface Standard: IEEE 1394

Compliance with the IEEE 1394 drive interface standard ensures compatibility with a wide range of devices and systems, enabling seamless connectivity and data transfer.

Technical Specifications

Bus Controllers TSB12LV26PZT attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

Maximum Data Transfer Rate:

132 MBps

Drive Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TSB12LV26PZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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