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TSB12LV23PZR

Texas Instruments

TSB12LV23PZR by Texas Instruments

TSB12LV23PZR by Texas Instruments is a Bus Controller with 32-bit Address Bus, 8-bit External Data Bus, and 50 MBps Max Data Transfer Rate. It operates at 3-3.6V, -40 to +70°C, suitable for IEEE1394 Drive Interface in commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,053 parts In-Stock

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Digiode

USA . 260 parts In-Stock

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260

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Distributors (Availability)

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AZTECH Wire

Italy . 691 parts In-Stock

1+ parts

$19.045

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691

$19.045

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Parana Technologies

USA . 1,775 parts In-Stock

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$22.229

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$22.890

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$22.229

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One Stop Electronics

USA . 1,388 parts In-Stock

1+ parts

$23.000

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1,388

$23.000

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DigiPath Technology Company

USA . 512 parts In-Stock

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$24.476

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$22.518

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512

$24.476

$22.518

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ChromeModa Solutions

Germany . 2,674 parts In-Stock

1+ parts

$24.976

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$20.480

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2,674

$24.976

$20.480

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IDEA Electronic Components Group

UK . 842 parts In-Stock

1+ parts

$24.976

100+ parts

$23.727

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$22.478

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842

$24.976

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$22.478

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Corohmni

South Africa . 1,223 parts In-Stock

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$27.381

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Corphita

USA . 992 parts In-Stock

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Overview

Unleash the power of seamless data transfer with the TSB12LV23PZR by Texas Instruments. Crafted with precision and innovation, this bus controller is designed to elevate your connectivity experience. Whether you're in need of high-speed data transmission or reliable communication between devices, this product delivers unparalleled performance. With Texas Instruments' renowned quality and expertise in the field, you can trust that you're getting a top-of-the-line solution for all your networking needs. Upgrade your systems today and discover the difference with the TSB12LV23PZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, perfect for use in various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the bus controller on a circuit board, saving space and enabling a more compact design.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V ensures that the bus controller can handle a wide range of power inputs, making it versatile and suitable for different system requirements.

Address Bus Width: 32

A wide address bus width of 32 allows for efficient communication and data transfer between different components, enhancing the performance and speed of the bus controller.

Package Shape: SQUARE

The square package shape provides a uniform and compact form factor, making it easy to integrate the bus controller into various systems or designs.

No. of Terminals: 100

Having a high number of terminals (100) offers a wide range of connection options and versatility in integrating the bus controller into complex systems or circuits.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances the overall space efficiency and allows for a more streamlined and compact design when integrating the bus controller.

Minimum Supply Voltage: 3 V

The low minimum supply voltage of 3 V ensures that the bus controller can operate efficiently even with lower power inputs, making it energy-efficient and versatile in different power scenarios.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the bus controller can withstand elevated temperatures, ensuring reliable performance in various operating environments.

Maximum Data Transfer Rate: 50 MBps

The high maximum data transfer rate of 50 MBps allows for swift and efficient data communication within the system, enabling fast processing and performance.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature of 0°C, the bus controller can function effectively even in colder environments, ensuring consistent performance in various temperature conditions.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection for the bus controller, ensuring reliable data transmission and reducing the risk of connectivity issues.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm helps in maintaining a compact and slim profile for the bus controller, making it suitable for space-constrained applications or designs.

Width: 14 mm

The width of 14 mm offers a balance between compactness and accessibility, allowing for easy integration of the bus controller into various systems or circuit layouts.

External Data Bus Width: 8

The external data bus width of 8 enables efficient data transfer between external devices and the bus controller, enhancing compatibility and performance in diverse setups.

Maximum Clock Frequency: 33 MHz

The high maximum clock frequency of 33 MHz supports fast data processing and communication, ensuring swift performance and responsiveness in demanding applications.

Length: 14 mm

With a length of 14 mm, the bus controller maintains a compact and space-efficient design, making it suitable for integration into various systems or devices with limited space availability.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures that the bus controller operates reliably in standard temperature conditions, making it suitable for a wide range of commercial applications.

Peripheral IC Type: BUS CONTROLLER, PCI

The peripheral IC type of bus controller, PCI, indicates compatibility with PCI interfaces, ensuring seamless integration and communication with other PCI devices in the system.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with various system configurations, making the bus controller energy-efficient and reliable in operation.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable data transmission and reducing the risk of connectivity issues, making the bus controller a dependable choice.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides a standard power input for the bus controller, ensuring compatibility and stability in power requirements across different systems and applications.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, the bus controller offers precise and compact terminal connections, enabling easy integration into densely packed circuit layouts while ensuring reliable data transmission.

Drive Interface Standard: IEEE 1394

Being compliant with the IEEE 1394 drive interface standard ensures compatibility and seamless integration with IEEE 1394 devices, enhancing connectivity and data transfer capabilities of the bus controller.

Technical Specifications

Bus Controllers TSB12LV23PZR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

50 MBps

Drive Interface Standard:

IEEE 1394

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TSB12LV23PZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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