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TSB12LV23PZ

Texas Instruments

TSB12LV23PZ by Texas Instruments

TSB12LV23PZ by Texas Instruments is a bus controller with 32-bit address bus width, 50 MBps data transfer rate, and 33 MHz clock frequency. It is used in PCI peripheral ICs for IEEE 1394 drive interfaces, operating at temperatures b/w 0-70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,471 parts In-Stock

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Digiode

USA . 2,072 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 677 parts In-Stock

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Prism Electronics

USA . 138 parts In-Stock

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AZTECH Wire

Italy . 441 parts In-Stock

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$5.776

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441

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One Stop Electronics

USA . 1,157 parts In-Stock

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$23.000

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Parana Technologies

USA . 623 parts In-Stock

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$72.893

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DigiPath Technology Company

USA . 882 parts In-Stock

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$80.264

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Corohmni

South Africa . 1,073 parts In-Stock

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$80.393

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ChromeModa Solutions

Germany . 5,004 parts In-Stock

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$81.902

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$67.160

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$81.902

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

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$81.902

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$77.807

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$73.712

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1,675

$81.902

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Authorized Procurement Solutions

USA . 12,600 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,195 parts In-Stock

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Corphita

USA . 1,826 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Unlock seamless data transfer and superior performance with the TSB12LV23PZ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus controllers that are perfect for various applications. With a maximum data transfer rate of 50 MBps, this product offers unmatched speed and reliability. Say goodbye to slow transfers and hello to efficient data management with the TSB12LV23PZ. Trust in Texas Instruments to provide you with cutting-edge technology that will revolutionize your workflow.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, which is ideal for portable or mobile applications.

Surface Mount: YES

The surface mount technology allows for easy and efficient installation on circuit boards, saving time and space during assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this product is suitable for low-power applications and helps in energy efficiency.

Address Bus Width: 32

A wide address bus width of 32 allows for high-speed communication and efficient data transfer between components.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it ideal for devices with limited space.

Power Supplies (V): 3.3,3.3/5

The availability of multiple power supply options ensures compatibility with different systems and enables flexible voltage configurations.

No. of Terminals: 100

A high number of terminals (100) provide ample connectivity options for connecting various devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package styles contribute to an efficient and space-saving design, ideal for modern compact electronics.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures compatibility with a wide range of power sources and improves the versatility of the product.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperatures, making it suitable for industrial environments.

Maximum Data Transfer Rate: 50 MBps

A high maximum data transfer rate of 50 MBps ensures quick and efficient data exchange, critical for demanding applications such as multimedia or networking.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in cold environments, making the product versatile in various operating conditions.

Terminal Position: QUAD

The quad terminal position provides stability and reliable connectivity, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm minimizes the overall profile of the product, enhancing compatibility with slim or compact devices.

Width: 14 mm

With a width of 14 mm, this product can be easily integrated into various electronic systems without occupying excessive space.

External Data Bus Width: 8

An external data bus width of 8 ensures efficient data transfer between external devices, enhancing performance and speed of the overall system.

Maximum Clock Frequency: 33 MHz

The maximum clock frequency of 33 MHz enables fast and synchronized data processing, essential for real-time applications and high-speed computing.

Length: 14 mm

The compact length of 14 mm complements the product's overall small form factor, making it suitable for devices with limited physical space.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation within standard temperature ranges, making the product suitable for commercial applications.

Peripheral IC Type: BUS CONTROLLER, PCI

Being a bus controller PCI peripheral IC type, this product facilitates efficient communication and data transfer between different components in a system, improving overall system performance.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, enhancing the efficiency and reliability of the device.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable solder connections, reducing the risk of signal loss or disconnection over time.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with standard voltage levels, facilitating integration into various electronic systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting and compact design, ideal for miniaturized or densely populated circuit boards.

Drive Interface Standard: IEEE 1394

The IEEE 1394 drive interface standard ensures compatibility with a wide range of devices and systems, allowing seamless connectivity and data exchange.

Technical Specifications

Bus Controllers TSB12LV23PZ attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

50 MBps

Drive Interface Standard:

IEEE 1394

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TSB12LV23PZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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