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TSB12LV31PZR

Texas Instruments

TSB12LV31PZR by Texas Instruments

TSB12LV31PZR by Texas Instruments is a bus controller with 8-bit address bus width, 16-bit external data bus width, and 50 MHz max clock frequency. It is used in IEEE 1394 drive interfaces for high-speed data transfer at up to 25 MBps. The package style is flatpack, low profile, fine pitch with a terminal pitch of 0.5 mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,213 parts In-Stock

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Digiode

USA . 3,212 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,220 parts In-Stock

1+ parts

$11.000

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$11.000

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AZTECH Wire

Italy . 736 parts In-Stock

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$17.709

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736

$17.709

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Corohmni

South Africa . 1,153 parts In-Stock

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$33.461

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$33.461

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Parana Technologies

USA . 544 parts In-Stock

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$41.253

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544

$41.253

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DigiPath Technology Company

USA . 761 parts In-Stock

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$45.425

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$41.791

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761

$45.425

$41.791

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ChromeModa Solutions

Germany . 5,617 parts In-Stock

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$46.352

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$38.009

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$46.352

$38.009

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IDEA Electronic Components Group

UK . 282 parts In-Stock

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$46.352

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$44.034

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$41.717

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$46.352

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$41.717

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Corphita

USA . 3,970 parts In-Stock

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Overview

Unlock seamless data transfer and reliable performance with the TSB12LV31PZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-tier quality and cutting-edge technology in their Bus Controllers. Perfect for applications requiring high-speed data transfer, this product offers unparalleled value with its efficient design and maximum data transfer rate of 25 MBps. Experience the advantage of smooth operations and superior connectivity with the TSB12LV31PZR, setting new standards in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for mobile or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power input, ensuring compatibility with a wide range of systems.

Address Bus Width: 8

The 8-bit address bus width enables the controller to efficiently manage and communicate with multiple devices or components.

Package Shape: SQUARE

The square package shape facilitates easy placement and alignment within a circuit design, optimizing space utilization.

No. of Terminals: 100

The ample number of terminals provides flexibility in connectivity options and supports robust communication interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances compatibility with modern PCB designs and enables high-density mounting.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power usage and extends the product's compatibility with different power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable operation in various environmental conditions without compromising performance.

Maximum Data Transfer Rate: 25 MBps

The high data transfer rate enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable functionality even in cold environments, making the product versatile in use.

Terminal Position: QUAD

The quad terminal position provides stability and secure connection points, reducing the risk of signal interference or loss.

Maximum Seated Height: 1.6 mm

The low seated height minimizes the overall profile of the controller, making it suitable for compact system designs.

Width: 14 mm

The compact width dimensions allow for efficient PCB layout and component placement, optimizing space utilization.

External Data Bus Width: 16

The wide 16-bit external data bus width enables high-speed data transfer and efficient communication with external devices.

Maximum Clock Frequency: 50 MHz

The high clock frequency facilitates rapid data processing and supports real-time operations, improving overall system responsiveness.

Length: 14 mm

The compact length dimensions enable easy integration into system designs with space constraints, ensuring compatibility with various setups.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in typical operating environments, making it suitable for a wide range of applications.

Peripheral IC Type: BUS CONTROLLER, IEEE 488 (GPIB)

The specific peripheral IC type indicates compatibility with IEEE 488 (GPIB) standards, ensuring seamless integration into existing systems or networks.

Technology: CMOS

The use of CMOS technology offers low power consumption, high noise immunity, and compatibility with various system architectures, enhancing overall reliability.

Terminal Form: GULL WING

The gull wing terminal form provides reliable solder joints and easy assembly onto PCBs, ensuring secure connections for optimal performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage specification indicates the typical operating voltage, ensuring stable and consistent power delivery to the controller.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and precise connections, enhancing overall connectivity and system reliability.

Drive Interface Standard: IEEE 1394

The compatibility with the IEEE 1394 drive interface standard enables seamless connectivity with IEEE 1394 devices, enhancing system versatility and compatibility.

Technical Specifications

Bus Controllers TSB12LV31PZR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

8

Maximum Clock Frequency:

50 MHz

Maximum Data Transfer Rate:

25 MBps

Drive Interface Standard:

IEEE 1394

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TSB12LV31PZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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