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TSB12LV26IPZT

Texas Instruments

TSB12LV26IPZT by Texas Instruments

TSB12LV26IPZT by Texas Instruments is a bus controller IC with 100 terminals, operating at 3.3V nominal voltage and supporting a max data transfer rate of 132 MBps. It is designed for IEEE 1394 drive interfaces in applications requiring high-speed data communication within compact spaces.

Median Price

$8.050

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,722 parts In-Stock

1+ parts

-

100+ parts

$6.440

1k+ parts

$5.760

10k+ parts

$5.420

2,722

-

$6.440

$5.760

$5.420

DigiKey

USA . 2,722 parts In-Stock

1+ parts

-

100+ parts

$8.480

1k+ parts

-

10k+ parts

-

2,722

-

$8.480

-

-

Verical

USA . 2,722 parts In-Stock

1+ parts

-

100+ parts

$8.050

1k+ parts

$7.200

10k+ parts

$6.775

2,722

-

$8.050

$7.200

$6.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,825 parts In-Stock

1+ parts

$6.792

100+ parts

-

1k+ parts

-

10k+ parts

-

2,825

$6.792

-

-

-

Vyrian

USA . 4,068 parts In-Stock

1+ parts

$7.150

100+ parts

-

1k+ parts

-

10k+ parts

-

4,068

$7.150

-

-

-

DigiKey Marketplace

USA . 2,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,722

-

-

-

-

North Shore Components

USA . 311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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311

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-

-

-

Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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1

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,058 parts In-Stock

1+ parts

$6.435

100+ parts

-

1k+ parts

-

10k+ parts

-

3,058

$6.435

-

-

-

Vigor

Singapore . 2,722 parts In-Stock

1+ parts

$6.860

100+ parts

-

1k+ parts

-

10k+ parts

-

2,722

$6.860

-

-

-

Corohmni

South Africa . 5,104 parts In-Stock

1+ parts

$51.602

100+ parts

-

1k+ parts

-

10k+ parts

-

5,104

$51.602

-

-

-

Parana Technologies

USA . 2,044 parts In-Stock

1+ parts

$76.466

100+ parts

$7,101.040

1k+ parts

$68.820

10k+ parts

-

2,044

$76.466

$7,101.040

$68.820

-

DigiPath Technology Company

USA . 282 parts In-Stock

1+ parts

$84.199

100+ parts

$77.463

1k+ parts

-

10k+ parts

-

282

$84.199

$77.463

-

-

ChromeModa Solutions

Germany . 5,751 parts In-Stock

1+ parts

$85.917

100+ parts

$70.452

1k+ parts

-

10k+ parts

-

5,751

$85.917

$70.452

-

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IDEA Electronic Components Group

UK . 1,294 parts In-Stock

1+ parts

$85.917

100+ parts

$81.621

1k+ parts

$77.325

10k+ parts

-

1,294

$85.917

$81.621

$77.325

-

Microchip USA

USA . 391 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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391

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Overview

Experience seamless data transfer and reliable performance with the TSB12LV26IPZT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in their bus controllers. Ideal for PCI applications, this product offers lightning-fast data transfer rates of up to 132 MBps, making it perfect for high-speed connectivity needs. With a compact design and durable construction, the TSB12LV26IPZT provides unmatched value and efficiency for all your networking requirements. Upgrade your system today and elevate your business operations with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mounting allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in usage.

No. of Terminals: 100

Having a large number of terminals allows for connection to various other components, expanding the product's capabilities.

Maximum Data Transfer Rate: 132 MBps

The high data transfer rate enables fast and efficient communication between devices, enhancing overall system performance.

Width: 14 mm

The compact width makes the product suitable for applications where space is limited.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high reliability, making the product energy-efficient and dependable.

Drive Interface Standard: IEEE 1394

Compliance with the IEEE 1394 standard ensures compatibility with a wide range of devices, enhancing interoperability.

Technical Specifications

Bus Controllers TSB12LV26IPZT attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

Maximum Data Transfer Rate:

132 MBps

Drive Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TSB12LV26IPZT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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