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TSB12LV23APZ

Texas Instruments

TSB12LV23APZ by Texas Instruments

TSB12LV23APZ by Texas Instruments is a Bus Controller with 32-bit Address and External Data Bus Width. It operates at 3-3.6V, supports data transfer rates up to 132MBps, and is ideal for PCI peripherals in commercial-grade applications like Cardbus and VGA interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,904 parts In-Stock

1+ parts

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7,904

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Digiode

USA . 3,871 parts In-Stock

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3,871

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$9.034

100+ parts

-

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338

$9.034

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Corohmni

South Africa . 2,552 parts In-Stock

1+ parts

$15.497

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2,552

$15.497

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One Stop Electronics

USA . 905 parts In-Stock

1+ parts

$27.000

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905

$27.000

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Parana Technologies

USA . 583 parts In-Stock

1+ parts

$74.626

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583

$74.626

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DigiPath Technology Company

USA . 1,615 parts In-Stock

1+ parts

$82.173

100+ parts

$75.599

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1,615

$82.173

$75.599

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ChromeModa Solutions

Germany . 2,867 parts In-Stock

1+ parts

$83.850

100+ parts

$68.757

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2,867

$83.850

$68.757

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IDEA Electronic Components Group

UK . 734 parts In-Stock

1+ parts

$83.850

100+ parts

$79.658

1k+ parts

$75.465

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734

$83.850

$79.658

$75.465

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Corphita

USA . 3,983 parts In-Stock

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3,983

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Overview

Elevate your system's performance with the TSB12LV23APZ by Texas Instruments, a cutting-edge Bus Controller designed to enhance data transfer speeds and connectivity. Backed by the renowned quality of Texas Instruments, this sleek and compact device offers seamless integration with various peripherals, making it ideal for applications such as Cardbus and VGA compatibility. With a maximum data transfer rate of 132 MBps and a temperature grade of commercial, this innovative technology ensures reliable and efficient operation. Upgrade your system today and experience the unmatched value and benefits that the TSB12LV23APZ has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus controller.

Surface Mount: YES

This allows for easy installation on a printed circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Supports a high voltage input range, making it compatible with a variety of power sources.

Address Bus Width: 32

Offers a wide address bus width, allowing for efficient data transfer and processing.

Package Shape: SQUARE

Square shape saves space on the PCB and allows for efficient placement in compact electronic devices.

No. of Terminals: 100

Provides ample connection points for interfacing with other components in the system.

Maximum Operating Temperature: 70 °C

Can operate effectively in high temperature environments, ensuring reliable performance under various conditions.

Maximum Data Transfer Rate: 132 MBps

High data transfer rate enables fast communication between devices, improving overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the bus controller.

Nominal Supply Voltage: 3.3 V

Stable supply voltage ensures consistent operation of the device, minimizing the risk of malfunctions.

Technical Specifications

Bus Controllers TSB12LV23APZ attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

CARDBUS; VGA

Maximum Data Transfer Rate:

132 MBps

Drive Interface Standard:

IEEE 1394

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TSB12LV23APZ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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