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TSB12LV26PZ

Texas Instruments

TSB12LV26PZ by Texas Instruments

TSB12LV26PZ by Texas Instruments is a Bus Controller with 32-bit Address and External Data Bus Width. It operates at 3-3.6V, supports up to 50MBps data transfer rate, and has a max clock frequency of 33MHz. Ideal for PCI bus compatibility applications requiring IEEE 1394A drive interface standard.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,822 parts In-Stock

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Digiode

USA . 1,008 parts In-Stock

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1,008

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Distributors (Availability)

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AZTECH Wire

Italy . 425 parts In-Stock

1+ parts

$16.609

100+ parts

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425

$16.609

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Parana Technologies

USA . 510 parts In-Stock

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$17.225

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$17.440

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510

$17.225

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$17.440

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DigiPath Technology Company

USA . 348 parts In-Stock

1+ parts

$18.967

100+ parts

$17.450

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348

$18.967

$17.450

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ChromeModa Solutions

Germany . 6,749 parts In-Stock

1+ parts

$19.354

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$15.870

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6,749

$19.354

$15.870

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IDEA Electronic Components Group

UK . 2,297 parts In-Stock

1+ parts

$19.354

100+ parts

$18.386

1k+ parts

$17.419

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2,297

$19.354

$18.386

$17.419

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Corohmni

South Africa . 6 parts In-Stock

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$26.165

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6

$26.165

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One Stop Electronics

USA . 1,644 parts In-Stock

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$34.000

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$34.000

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Corphita

USA . 3,093 parts In-Stock

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Overview

Enhance your electronic designs with the TSB12LV26PZ by Texas Instruments, a top-tier manufacturer known for their industry-leading quality. This Bus Controller offers lightning-fast data transfer rates of up to 50 MBps, making it perfect for high-performance applications. With a compact design and wide temperature range, this product is versatile and reliable. Elevate your projects with the TSB12LV26PZ and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

Surface Mount: YES

Allows for easy installation on a circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, ensuring reliable operation.

Address Bus Width: 32

Provides sufficient capacity for addressing memory locations and data transfer within the system.

Package Shape: SQUARE

Compact design for efficient use of space on the PCB.

No. of Terminals: 100

Provides ample connection points for interfacing with other components in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Suitable for space-constrained environments and supports high-density packaging.

Minimum Supply Voltage: 3 V

Works efficiently with lower voltage sources to optimize power consumption.

Maximum Operating Temperature: 70 °C

Ensures stability and reliable performance under normal operating conditions.

Maximum Data Transfer Rate: 50 MBps

High-speed data transfer capability for efficient communication between devices.

Minimum Operating Temperature: 0 °C

Designed to function reliably even under cold temperature conditions.

Terminal Position: QUAD

Facilitates easy connection and soldering during assembly.

Maximum Seated Height: 1.6 mm

Low-profile design for fitting in compact spaces and reducing interference with other components.

Width: 14 mm

Compact form factor for efficient use of PCB real estate.

External Data Bus Width: 32

Matches the internal data bus width for seamless data transfer within the system.

Maximum Clock Frequency: 33 MHz

Supports high-speed data processing and operation.

Length: 14 mm

Compact dimensions for space-saving and efficient PCB layout.

Temperature Grade: COMMERCIAL

Suitable for use in commercial-grade applications with standard temperature requirements.

Peripheral IC Type: BUS CONTROLLER, PCI

Specifically designed for bus control applications and PCI compatibility for seamless integration.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Facilitates easy soldering to the PCB for reliable connections.

Nominal Supply Voltage: 3.3 V

Optimized supply voltage for stable and efficient operation.

Bus Compatibility: PCI

Ensures compatibility with the PCI bus standard for seamless integration with other system components.

Terminal Pitch: 0.5 mm

Fine pitch for high-density packaging and space savings on the PCB.

Drive Interface Standard: IEEE 1394; IEEE 1394A

Supports industry-standard drive interfaces for broad compatibility and ease of integration.

Technical Specifications

Bus Controllers TSB12LV26PZ attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Bus Compatibility:

PCI

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

50 MBps

Drive Interface Standard:

IEEE 1394; IEEE 1394A

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TSB12LV26PZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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