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TSB12LV26PZTG4

Texas Instruments

TSB12LV26PZTG4 by Texas Instruments

TSB12LV26PZTG4 by Texas Instruments is a 100-terminal bus controller with a max data transfer rate of 132 MBps and a clock frequency of 33 MHz. It is used in PCI peripherals, featuring IEEE 1394 drive interface standard for high-speed communication applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,296 parts In-Stock

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Digiode

USA . 1,245 parts In-Stock

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EMSNET

USA . 10 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 403 parts In-Stock

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$8.946

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One Stop Electronics

USA . 508 parts In-Stock

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$12.000

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$12.000

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Parana Technologies

USA . 787 parts In-Stock

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$19.485

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$19.492

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ChromeModa Solutions

Germany . 5,256 parts In-Stock

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$21.893

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$17.952

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IDEA Electronic Components Group

UK . 1,804 parts In-Stock

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$21.893

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$20.798

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$19.704

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Corohmni

South Africa . 933 parts In-Stock

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$38.115

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Corphita

USA . 3,483 parts In-Stock

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DigiPath Technology Company

USA . 1,839 parts In-Stock

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$19.739

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Overview

Experience seamless data transfer and superior performance with the TSB12LV26PZTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The TSB12LV26PZTG4 falls under the category of Bus Controllers, offering a wide range of applications for various electronic devices. With a maximum data transfer rate of 132 MBps and a maximum clock frequency of 33 MHz, this product guarantees fast and efficient operation. Trust Texas Instruments to deliver unmatched value and benefits to enhance your electronic projects with the TSB12LV26PZTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the bus controller easy to handle and resistant to physical damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and cost during production.

Maximum Data Transfer Rate: 132 MBps

With a high data transfer rate, this bus controller can efficiently handle large amounts of data, making it suitable for high-speed applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, increasing the efficiency and reliability of the bus controller.

Drive Interface Standard: IEEE 1394

Compliance with the IEEE 1394 standard ensures compatibility with a wide range of devices and systems, making integration seamless.

Technical Specifications

Bus Controllers TSB12LV26PZTG4 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

132 MBps

Drive Interface Standard:

IEEE 1394

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

100

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TSB12LV26PZTG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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