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TSB12LV21PGF

Texas Instruments

TSB12LV21PGF by Texas Instruments

TSB12LV21PGF by Texas Instruments is a bus controller with 32-bit address and external data bus width. It operates at a max clock frequency of 33 MHz, supporting a data transfer rate of up to 50 MBps. This low-profile, fine-pitch IC is ideal for PCI peripheral devices requiring IEEE 1394 drive interface standard.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,831 parts In-Stock

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Digiode

USA . 4,962 parts In-Stock

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Chip Stock

USA . 495 parts In-Stock

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495

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Prism Electronics

USA . 45 parts In-Stock

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45

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Component Electronics Inc.

Canada . 7 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,955 parts In-Stock

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$14.423

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$14.865

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$14.423

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$14.865

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DigiPath Technology Company

USA . 647 parts In-Stock

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$15.882

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$14.611

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647

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$14.611

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IDEA Electronic Components Group

UK . 1,739 parts In-Stock

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$16.206

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$15.396

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$14.585

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1,739

$16.206

$15.396

$14.585

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ChromeModa Solutions

Germany . 1,109 parts In-Stock

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$16.206

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$13.289

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$13.289

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AZTECH Wire

Italy . 603 parts In-Stock

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$18.989

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One Stop Electronics

USA . 1,330 parts In-Stock

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$31.000

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Corohmni

South Africa . 92 parts In-Stock

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$74.454

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A-Z Elektronik GmbH

Germany . 6,809 parts In-Stock

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Corphita

USA . 2,383 parts In-Stock

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Kepictronics

USA . 376 parts In-Stock

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Overview

Discover the TSB12LV21PGF by Texas Instruments, a top-quality bus controller designed to enhance your electronic systems. With Texas Instruments' renowned reputation for reliability and innovation, this product offers seamless integration and superior performance. Perfect for a wide range of applications, this bus controller ensures fast data transfer rates and efficient connectivity. Upgrade your projects with the TSB12LV21PGF and experience the value and benefits it brings to your designs. Elevate your electronics with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing the versatility of the product.

Address Bus Width: 32

A 32-bit address bus width provides ample address space for efficient data processing and communication between components.

Package Shape: SQUARE

The square package shape allows for uniform and compact placement on circuit boards, optimizing space utilization.

No. of Terminals: 176

With 176 terminals, the product can support a wide range of connections and interfaces, enhancing its compatibility with various systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures a sleek and compact design, suitable for space-constrained applications.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and operation, reducing energy costs and prolonging battery life.

Maximum Data Transfer Rate: 50 MBps

With a maximum data transfer rate of 50 MBps, the product can handle high-speed data communication, enabling quick and efficient performance.

Terminal Position: QUAD

The quad terminal position allows for stable and secure connections, minimizing signal interference and ensuring reliable data transfer.

Maximum Seated Height: 1.6 mm

The low maximum seated height reduces the overall profile of the product, making it suitable for slim and compact devices.

Width: 24 mm

The 24 mm width provides a balanced form factor, enabling easy integration into various system designs and layouts.

External Data Bus Width: 32

A 32-bit external data bus width allows for efficient data transfer between external devices, improving system performance and throughput.

Maximum Clock Frequency: 33 MHz

The high maximum clock frequency of 33 MHz enables rapid data processing and communication, ensuring smooth and responsive operation.

Length: 24 mm

The 24 mm length offers a compact footprint, making the product suitable for space-constrained applications without compromising functionality.

Peripheral IC Type: BUS CONTROLLER, PCI

As a bus controller with a peripheral component interconnect (PCI) interface, the product can effectively manage data traffic and communication in PCI-based systems.

Technology: CMOS

Utilizing complementary metal-oxide-semiconductor (CMOS) technology ensures low power consumption, high noise immunity, and reliable operation for the product.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and robust mechanical connections, ensuring stable and secure terminal attachment.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides a standard power input for the product, ensuring compatibility with common voltage levels in electronic systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for dense packing of terminals, optimizing board space and enabling high-density circuit designs.

Drive Interface Standard: IEEE 1394

Compliance with the IEEE 1394 drive interface standard ensures seamless connectivity and compatibility with IEEE 1394 devices, facilitating data transfer and communication.

Technical Specifications

Bus Controllers TSB12LV21PGF attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

50 MBps

Drive Interface Standard:

IEEE 1394

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of Terminals:

176

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TSB12LV21PGF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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