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PI7C9X2G303ELZXEX

Diodes Incorporated

PI7C9X2G303ELZXEX by Diodes Incorporated

Diodes Inc. PI7C9X2G303ELZXEX is a 136-terminal bus controller with max supply voltage of 1.1V and data transfer rate of 625MBps. Ideal for industrial applications, it supports I2C, ISA, SMBUS, and VGA bus compatibility at an operating temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,688 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 570 parts In-Stock

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$13.517

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570

$13.517

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Ampacity Inc.

Singapore . 183 parts In-Stock

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$23.000

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Corohmni

South Africa . 978 parts In-Stock

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$79.649

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978

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Continental Prestige Electronics

USA . 2,521 parts In-Stock

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Microchip USA

USA . 2,411 parts In-Stock

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Argo Parts USA

USA . 2,105 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Unleash the power of seamless data transfer with the PI7C9X2G303ELZXEX by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated delivers top-quality bus controllers that offer unparalleled performance and reliability. Ideal for a wide range of applications including I2C, ISA, SMBUS, and VGA compatibility, this product boasts a maximum data transfer rate of 625 MBps, making it the perfect solution for high-speed communication needs. Elevate your projects with the exceptional value, benefits, and advantages that the PI7C9X2G303ELZXEX brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology provides a compact and efficient way to mount the bus controller onto a PCB, making it suitable for small form factor applications.

Maximum Supply Voltage: 1.1 V

The maximum supply voltage of 1.1 V ensures that the bus controller operates within safe voltage limits, preventing damage to the device.

Package Shape: SQUARE

The square package shape allows for easy integration and placement of the bus controller on the PCB, optimizing space utilization.

No. of Terminals: 136

With a high number of terminals, the bus controller can support a wide range of connections and peripherals, enhancing the versatility of the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package style ensures efficient heat dissipation and space-saving design, ideal for industrial applications.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage of 0.9 V allows for efficient power consumption and operation in low power scenarios, increasing energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the bus controller can withstand harsh environmental conditions and ensure reliable performance in industrial settings.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate of 625 MBps enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the bus controller to function reliably in extreme temperature conditions, ensuring consistent operation in various environments.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection for peripheral devices, minimizing signal interference and ensuring reliable data transfer.

Maximum Seated Height: 0.85 mm

With a maximum seated height of 0.85 mm, the bus controller can be mounted in low profile applications without compromising structural integrity.

Width: 8 mm

The compact width of 8 mm allows for easy integration of the bus controller into tight spaces, making it suitable for applications with space constraints.

Length: 8 mm

The short length of 8 mm further enhances the compact and space-saving design of the bus controller, ideal for modern electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the bus controller can operate reliably in challenging industrial environments with varying temperature conditions.

Peripheral IC Type: BUS CONTROLLER, PCI

The bus controller with PCI compatibility enables seamless integration with a wide range of peripherals and devices, enhancing system connectivity and functionality.

Technology: CMOS

Utilizing CMOS technology allows the bus controller to operate at low power consumption levels while providing high-speed data processing, making it energy-efficient and reliable.

Terminal Form: NO LEAD

The no lead terminal form simplifies the mounting and connection process, reducing assembly complexity and ensuring a secure and reliable connection.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V provides a stable power source for the bus controller, ensuring consistent performance and preventing voltage fluctuations.

Bus Compatibility: I2C; ISA; SMBUS; VGA

Support for various bus interfaces such as I2C, ISA, SMBUS, and VGA enables the bus controller to communicate with a wide range of devices and peripherals, enhancing system compatibility.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4 mm allows for high-density mounting of the bus controller on the PCB, maximizing space utilization and improving overall system efficiency.

Technical Specifications

Bus Controllers PI7C9X2G303ELZXEX attributes and parameters. Explore more Bus Controllers devices from Diodes Incorporated

Specs

Address Bus Width:

0

Bus Compatibility:

I2C; ISA; SMBUS; VGA

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N136

Length:

8 mm

No. of Terminals:

136

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.85 mm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Peripheral IC Type:

Trade Compliance

PI7C9X2G303ELZXEX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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