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TUSB8041ARGCR

Texas Instruments

TUSB8041ARGCR by Texas Instruments

TUSB8041ARGCR by Texas Instruments is a 64-terminal bus controller IC with CMOS technology. It operates b/w 0-70°C, compatible with I2C and SMBus buses. The chip carrier package style has a square shape, suitable for applications requiring USB bus control in commercial-grade environments.

Median Price

$9.920

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 581 parts In-Stock

1+ parts

$9.920

100+ parts

$6.560

1k+ parts

$5.960

10k+ parts

$5.790

581

$9.920

$6.560

$5.960

$5.790

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 36 parts In-Stock

1+ parts

$4.223

100+ parts

-

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36

$4.223

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Digiode

USA . 660 parts In-Stock

1+ parts

$7.590

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660

$7.590

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Chip Stock

USA . 3,480 parts In-Stock

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3,480

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Vyrian

USA . 1,522 parts In-Stock

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1,522

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Sensible Micro Corp

USA . 130 parts In-Stock

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130

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Distributors (Availability)

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Corohmni

South Africa . 859 parts In-Stock

1+ parts

$4.223

100+ parts

-

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859

$4.223

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Argo Parts USA

USA . 2,513 parts In-Stock

1+ parts

$4.223

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2,513

$4.223

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Continental Prestige Electronics

USA . 924 parts In-Stock

1+ parts

$4.223

100+ parts

-

1k+ parts

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10k+ parts

$4.139

924

$4.223

-

-

$4.139

Advanced Electronics

New Zealand . 2,465 parts In-Stock

1+ parts

$4.350

100+ parts

$4.132

1k+ parts

$4.132

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-

2,465

$4.350

$4.132

$4.132

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Semicontronic

India . 1,858 parts In-Stock

1+ parts

$6.790

100+ parts

$6.620

1k+ parts

$6.586

10k+ parts

-

1,858

$6.790

$6.620

$6.586

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Ampacity Inc.

Singapore . 1,565 parts In-Stock

1+ parts

$6.790

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1,565

$6.790

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Corphita

USA . 720 parts In-Stock

1+ parts

$7.191

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720

$7.191

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Parana Technologies

USA . 704 parts In-Stock

1+ parts

$64.005

100+ parts

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704

$64.005

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DigiPath Technology Company

USA . 2,108 parts In-Stock

1+ parts

$70.478

100+ parts

$64.839

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2,108

$70.478

$64.839

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ChromeModa Solutions

Germany . 3,945 parts In-Stock

1+ parts

$71.916

100+ parts

$58.971

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3,945

$71.916

$58.971

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IDEA Electronic Components Group

UK . 2,234 parts In-Stock

1+ parts

$71.916

100+ parts

$68.320

1k+ parts

$64.724

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2,234

$71.916

$68.320

$64.724

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S.R.D Solutions

India . 40,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,881 parts In-Stock

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Lixinc

USA . 3,633 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,000 parts In-Stock

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2,000

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Futuretech Components

Singapore . 500 parts In-Stock

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500

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

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100+ parts

$0.587

1k+ parts

$0.587

10k+ parts

$0.587

500

-

$0.587

$0.587

$0.587

Overview

Discover the cutting-edge TUSB8041ARGCR from Texas Instruments, a leading manufacturer known for top-notch quality. As a versatile Bus Controller, this product offers seamless integration and efficient control in various applications. With a durable package body material and advanced technology, it ensures reliable performance. Whether you're in need of I2C or SMBUS compatibility, this chip carrier with a very thin profile has got you covered. Experience the convenience and innovation that Texas Instruments brings to the table with the TUSB8041ARGCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material ensures durability and protects the internal components.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on the circuit board.

Maximum Supply Voltage: 1.26 V

With a high maximum supply voltage, this bus controller can handle higher power requirements with ease.

Package Shape: SQUARE

The square package shape provides a compact design, ideal for applications where space is limited.

No. of Terminals: 64

The abundance of terminals allows for connections to various devices, making it versatile in different setups.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile styles enhances thermal management and overall performance.

Minimum Supply Voltage: 0.99 V

The low minimum supply voltage ensures energy efficiency and reliable operation in various power conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature suitability for use in harsh environments without compromising performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: QUAD

The quad terminal position facilitates easy connections and compatibility with different systems.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a compact design and efficient use of space on the circuit board.

Width: 9 mm

The 9mm width offers a slim profile and flexibility in installation options.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures durability and reliability during soldering processes.

Length: 9 mm

The 9mm length makes this bus controller compact and suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

The commercial-grade temperature tolerance ensures reliable performance in standard operating conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The compatibility with bus controller and universal serial bus technologies provides versatility for various applications.

Technology: CMOS

The use of CMOS technology ensures efficient power consumption and high-speed performance.

Terminal Form: NO LEAD

The no-lead terminal form offers a lead-free and environmentally friendly option for the product.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V ensures stable and reliable power supply for consistent performance.

Bus Compatibility: I2C; SMBUS

Compatibility with I2C and SMBus ensures flexibility and interoperability with different bus systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and space-saving on the circuit board.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates the product's resistance to moisture and ensures reliability in varying environmental conditions.

Technical Specifications

Bus Controllers TUSB8041ARGCR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO CAN USE 3V-3.6V SUPPLY RANGE.

Address Bus Width:

0

Bus Compatibility:

I2C; SMBUS

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TUSB8041ARGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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