Loading...

TMX5703137BPGEQQ1

Texas Instruments

TMX5703137BPGEQQ1 by Texas Instruments

TMX5703137BPGEQQ1 by Texas Instruments is a 32-bit microcontroller with 22-bit address bus width, operating at up to 80 MHz. Ideal for automotive applications, it features ADC and DMA channels, along with 262144 bytes of RAM. With a compact package style and low profile design, this microcontroller offers high performance in a small form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,773

-

-

-

-

Digiode

USA . 2,936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,936

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,634 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,634

$4.000

-

-

-

AZTECH Wire

Italy . 512 parts In-Stock

1+ parts

$12.239

100+ parts

-

1k+ parts

-

10k+ parts

-

512

$12.239

-

-

-

Parana Technologies

USA . 392 parts In-Stock

1+ parts

$27.364

100+ parts

-

1k+ parts

$35.038

10k+ parts

-

392

$27.364

-

$35.038

-

IDEA Electronic Components Group

UK . 2,359 parts In-Stock

1+ parts

$30.746

100+ parts

$29.209

1k+ parts

$27.671

10k+ parts

-

2,359

$30.746

$29.209

$27.671

-

ChromeModa Solutions

Germany . 1,984 parts In-Stock

1+ parts

$30.746

100+ parts

$25.212

1k+ parts

-

10k+ parts

-

1,984

$30.746

$25.212

-

-

Corphita

USA . 2,208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,208

-

-

-

-

DigiPath Technology Company

USA . 501 parts In-Stock

1+ parts

-

100+ parts

$27.721

1k+ parts

-

10k+ parts

-

501

-

$27.721

-

-

Microchip USA

USA . 204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

204

-

-

-

-

Overview

Experience the cutting-edge technology of the TMX5703137BPGEQQ1 by Texas Instruments, a top-tier manufacturer known for its superior quality microcontrollers. With a wide range of applications in automotive and industrial settings, this powerful microcontroller offers unmatched performance and efficiency. Providing seamless integration, reliability, and versatility, this product is designed to meet the demanding requirements of today's advanced systems. Elevate your projects with the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability, affordability, and ability to protect the components inside.

Surface Mount: YES

Surface mount technology allows for smaller and more efficient PCB designs, making this microcontroller suitable for compact electronic devices.

Maximum Supply Voltage: 1.32 V

The low maximum supply voltage is suitable for applications where power efficiency is important, helping to prolong battery life.

Address Bus Width: 22

The wide address bus width allows for efficient communication within the microcontroller and with external devices.

Screening Level: AEC-Q100

This screening level ensures that the microcontroller meets the quality and reliability standards required for automotive applications.

Package Shape: SQUARE

The square package shape is easy to mount and provides a stable foundation for the microcontroller on the PCB.

Bit Size: 32

The 32-bit architecture enables the microcontroller to handle complex tasks and process data more efficiently.

Power Supplies (V): 1.2,3.3

The multiple power supply options offer flexibility in designing and powering different parts of the circuit, enhancing compatibility with various components.

No. of Terminals: 144

The high number of terminals allows for multiple connections and interfaces, making it versatile for different applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These package styles provide a compact and space-saving design, ideal for modern electronic devices with limited space.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even with low power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this microcontroller suitable for automotive and industrial applications where temperature fluctuations are common.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family is known for its high performance and real-time processing capabilities, making it suitable for demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in harsh environmental conditions.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital data, enabling it to interface with sensors and other analog devices.

DMA Channels: YES

DMA channels offload the CPU by transferring data between peripherals and memory, enhancing the overall efficiency and speed of the microcontroller.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections, ensuring stability and reliability in the circuit.

ROM Words: 3145728

The large ROM capacity enables the microcontroller to store complex program codes and data, making it suitable for versatile applications.

Maximum Seated Height: 1.6 mm

The low seated height makes this microcontroller suitable for thin and compact electronic devices where space is a constraint.

Width: 20 mm

The compact width of the microcontroller allows for easy integration into PCBs with limited space, enhancing overall design flexibility.

External Data Bus Width: 32

The wide external data bus width allows for fast data transfer between the microcontroller and external devices, improving overall system performance.

Maximum Clock Frequency: 80 MHz

The high maximum clock frequency enables the microcontroller to process instructions quickly and efficiently, making it suitable for time-sensitive applications.

Length: 20 mm

The compact length of the microcontroller allows for efficient use of PCB space, making it ideal for small electronic devices.

Temperature Grade: AUTOMOTIVE

The automotive grade temperature rating ensures that the microcontroller can withstand the temperature variations and harsh conditions often found in automotive environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture, this product offers high performance, low power consumption, and efficient instruction execution, making it a good choice for embedded systems.

RAM Bytes: 262144

The ample RAM capacity allows the microcontroller to store and manipulate data efficiently, enhancing its overall processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it suitable for energy-efficient and high-performance applications.

Terminal Form: GULL WING

The gull wing terminal form provides a strong and secure connection, ensuring reliability and durability in the circuit.

Maximum Supply Current: 350 mA

The low maximum supply current indicates energy efficiency, making this microcontroller suitable for battery-powered devices or applications requiring low power consumption.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable power source for the microcontroller, ensuring consistent and reliable operation.

PWM Channels: YES

The presence of PWM channels allows the microcontroller to generate pulse-width modulated signals, essential for controlling motors, LEDs, and other devices requiring precise analog control.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and flexible reprogramming of the microcontroller, enabling firmware updates and versatility in application development.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting of the microcontroller on the PCB, making it suitable for compact and space-efficient designs.

Speed: 160 rpm

The high speed capability of the microcontroller enables rapid data processing and response times, making it suitable for real-time applications.

No. of I/O Lines: 16

The 16 I/O lines provide sufficient interfacing options for connecting peripherals, sensors, and other devices, enhancing the microcontroller's versatility and functionality.

Technical Specifications

Microcontrollers TMX5703137BPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

16

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMX5703137BPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20