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TMX5700714ZWTQQ1

Texas Instruments

TMX5700714ZWTQQ1 by Texas Instruments

TMX5700714ZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 24-Ch 12-Bit ADC, 64K Data EEPROM, and 131072 RAM Bytes. It is designed for automotive applications with CAN, I2C, LIN connectivity options and operates at a max clock frequency of 80 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,336 parts In-Stock

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Digiode

USA . 4,890 parts In-Stock

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4,890

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Distributors (Availability)

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One Stop Electronics

USA . 368 parts In-Stock

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$16.000

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368

$16.000

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AZTECH Wire

Italy . 328 parts In-Stock

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$17.378

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Parana Technologies

USA . 2,177 parts In-Stock

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$23.909

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$24.546

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$23.909

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$24.546

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DigiPath Technology Company

USA . 359 parts In-Stock

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$26.327

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$24.221

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359

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ChromeModa Solutions

Germany . 3,995 parts In-Stock

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$26.864

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$22.028

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$26.864

$22.028

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IDEA Electronic Components Group

UK . 623 parts In-Stock

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$26.864

100+ parts

$25.521

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$24.178

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623

$26.864

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Corphita

USA . 3,863 parts In-Stock

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Microchip USA

USA . 367 parts In-Stock

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Overview

Experience superior performance and reliability with the TMX5700714ZWTQQ1 microcontroller by Texas Instruments. Known for their cutting-edge technology and exceptional quality, Texas Instruments delivers unmatched value to customers in the automotive industry. This microcontroller boasts a wide range of applications, from advanced driver assistance systems to infotainment displays. With its high-speed clock frequency, ample memory capacity, and extensive connectivity options, the TMX5700714ZWTQQ1 offers unparalleled benefits and advantages for your next automotive project. Trust Texas Instruments for top-of-the-line microcontrollers that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Ease of installation and space-saving design for compact electronic devices.

Maximum Supply Voltage: 1.32 V

Efficient power consumption and compatibility with low voltage systems.

Screening Level: AEC-Q100

Designed and qualified for automotive applications, ensuring reliability in harsh environments.

Bit Size: 32

High processing capability for handling complex tasks efficiently.

No. of Terminals: 337

Sufficient terminals for versatile connectivity options and interfacing with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Compact form factor with efficient heat dissipation and high-density mounting capabilities.

Minimum Supply Voltage: 1.14 V

Support for low voltage operation while maintaining stability and performance.

Maximum Operating Temperature: 125 °C

Suitable for operation in high-temperature environments commonly found in automotive applications.

Minimum Operating Temperature: -40 °C

Wide temperature range support for reliable operation in extreme conditions.

ADC Channels: YES

Analog-to-digital conversion capability for interfacing with sensors and external analog signals.

DMA Channels: YES

Efficient data transfer capabilities for handling high-speed and real-time processing tasks.

Terminal Position: BOTTOM

Ease of PCB layout and component placement for streamlined manufacturing processes.

ROM Words: 786432

Ample memory storage for program and data storage requirements.

Maximum Seated Height: 1.4 mm

Low profile design for compact and slim electronic devices.

Width: 16 mm

Compact form factor for space-saving design and integration in small electronic products.

Data EEPROM Size: 64K

Non-volatile memory storage for critical data retention even during power loss.

Peripherals: CAP(6), DMA(16), POR, PWM(14), QEP(2), TIMER(44), WDT

Versatile peripheral support for various control and communication functions in embedded systems.

Maximum Clock Frequency: 80 MHz

High-speed processing capability for real-time applications and performance-critical tasks.

Length: 16 mm

Compact form factor for space-saving design and integration in small electronic products.

Temperature Grade: AUTOMOTIVE

Specifically designed and qualified for automotive applications, ensuring reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing and control operations in embedded systems.

RAM Bytes: 131072

Ample volatile memory for data storage and processing tasks in embedded applications.

Technology: CMOS

Low power consumption and high noise immunity for energy-efficient and reliable operation.

Terminal Form: BALL

Ball terminal design for reliable connectivity and robust mechanical strength.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion.

Nominal Supply Voltage: 1.2 V

Standard supply voltage support for compatibility with a wide range of electronic systems.

PWM Channels: YES

Pulse-width modulation output support for controlling various actuators and devices.

Connectivity: CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI(2)

Diverse communication interfaces for connecting to external devices and networks in embedded systems.

ROM Programmability: FLASH

Flash memory programmability for flexible firmware updates and modifications.

Terminal Pitch: 0.8 mm

Fine pitch design for high-density mounting and space-saving PCB layouts.

Speed: 180 rpm

High-speed operation for real-time control applications in automotive and industrial systems.

On Chip Program ROM Width: 8

Efficient memory organization for optimized program storage and execution.

No. of I/O Lines: 101

Sufficient I/O lines for versatile interfacing and control functions in embedded applications.

Technical Specifications

Microcontrollers TMX5700714ZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B337

Length:

16 mm

No. of I/O Lines:

101

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

786432

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI(2)

Peripherals:

CAP(6), DMA(16), POR, PWM(14), QEP(2), TIMER(44), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMX5700714ZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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