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TMX5701227APGEQQ1R

Texas Instruments

TMX5701227APGEQQ1R by Texas Instruments

TMX5701227APGEQQ1R by Texas Instruments is a 32-bit microcontroller with 13-bit address bus width, operating at up to 80 MHz. Ideal for automotive applications, it features ADC and DMA channels, along with ROM programmability in a low-profile package style.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,042 parts In-Stock

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Digiode

USA . 3,558 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 497 parts In-Stock

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$19.725

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One Stop Electronics

USA . 630 parts In-Stock

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$33.000

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Parana Technologies

USA . 1,958 parts In-Stock

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$63.992

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ChromeModa Solutions

Germany . 1,480 parts In-Stock

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$71.901

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$58.959

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$71.901

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IDEA Electronic Components Group

UK . 282 parts In-Stock

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$71.901

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$68.306

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$64.711

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282

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$64.711

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Corphita

USA . 1,904 parts In-Stock

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DigiPath Technology Company

USA . 1,547 parts In-Stock

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$64.826

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Overview

Experience unparalleled quality and innovation with the TMX5701227APGEQQ1R microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This microcontroller offers a wide range of applications in automotive and industrial settings, providing customers with exceptional value and performance. With advanced features like ADC and DMA channels, along with a high clock frequency of 80 MHz, this product guarantees reliability and efficiency. Trust Texas Instruments to deliver top-of-the-line solutions for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly processes.

Maximum Supply Voltage: 1.32 V

Operating within a maximum supply voltage of 1.32V ensures energy efficiency and protects the microcontroller from overvoltage.

Address Bus Width: 13

A wider address bus width allows for larger memory address space, enabling more complex operations and computations.

Package Shape: SQUARE

Square package shape provides uniformity and ease of mounting on a PCB.

Bit Size: 32

32-bit architecture enables higher processing capabilities and performance for advanced applications.

No. of Terminals: 144

Having a high number of terminals allows for versatile connectivity options with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers compactness, low profile design, and fine pitch for space-saving and efficient board layout.

Minimum Supply Voltage: 1.14 V

Operating within a minimum supply voltage of 1.14V ensures reliable performance even under low power conditions.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures up to 125°C, suitable for automotive and industrial applications that may experience elevated temperatures.

Minimum Operating Temperature: -40 °C

Can function in extreme cold conditions down to -40°C, making it versatile for a wide range of environments.

ADC Channels: YES

Onboard ADC channels enable analog-to-digital conversion, essential for interfacing with analog sensors and signals.

DMA Channels: YES

Integrated DMA channels enhance data transfer efficiency and speed, reducing the workload on the CPU for improved performance.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connectivity on the PCB, minimizing the risk of disconnection.

Maximum Seated Height: 1.6 mm

Low profile with a maximum seated height of 1.6mm saves space and enables compact electronic designs.

Width: 20 mm

Compact width of 20mm allows for efficient board layout and integration into various device designs.

External Data Bus Width: 16

16-bit external data bus width facilitates faster data transfer between the microcontroller and external devices or memory.

Maximum Clock Frequency: 80 MHz

High clock frequency of 80MHz provides fast processing speeds and responsiveness for real-time applications.

Length: 20 mm

With a length of 20mm, the microcontroller is compact and suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance under harsh environmental conditions in vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller offers efficient processing and optimized performance for embedded control applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltages.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint strength and reliability for robust PCB assembly.

Nominal Supply Voltage: 1.2 V

Operating at a nominal supply voltage of 1.2V ensures stable performance and energy efficiency in various applications.

PWM Channels: YES

Support for PWM channels enables precise control of motor speeds, LED brightness, and other analog output applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates and modifications for enhanced functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and space-efficient PCB designs.

Speed: 160 rpm

Capable of operating at 160 revolutions per minute, suitable for motor control applications and other rotational speed monitoring tasks.

No. of I/O Lines: 16

Having 16 I/O lines provides sufficient interfacing capabilities for connecting to external devices, sensors, and peripherals.

Technical Specifications

Microcontrollers TMX5701227APGEQQ1R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

16

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMX5701227APGEQQ1R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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