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TMX5700914ZWTQQ1

Texas Instruments

TMX5700914ZWTQQ1 by Texas Instruments

TMX5700914ZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 1048576 ROM words and 131072 RAM bytes. It features 24-Ch 12-Bit ADC channels, CAN(3), I2C, SCI(2), SPI(5) connectivity, and operates at a max clock frequency of 80 MHz. Ideal for automotive applications due to AEC-Q100 screening level and temperature grade, offering advanced peripherals like DMA(16), POR, PWM(14), TIMER(45), WDT.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,114 parts In-Stock

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Digiode

USA . 2,759 parts In-Stock

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2,759

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Distributors (Availability)

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AZTECH Wire

Italy . 241 parts In-Stock

1+ parts

$10.183

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241

$10.183

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One Stop Electronics

USA . 870 parts In-Stock

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$24.000

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870

$24.000

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Parana Technologies

USA . 1,692 parts In-Stock

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$32.602

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$109.039

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$32.602

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$109.039

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DigiPath Technology Company

USA . 1,384 parts In-Stock

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$35.899

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$33.027

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1,384

$35.899

$33.027

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ChromeModa Solutions

Germany . 3,067 parts In-Stock

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$36.632

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$30.038

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3,067

$36.632

$30.038

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IDEA Electronic Components Group

UK . 1,405 parts In-Stock

1+ parts

$36.632

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$34.800

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$32.969

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1,405

$36.632

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$32.969

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Corphita

USA . 1,941 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMX5700914ZWTQQ1 microcontroller by Texas Instruments! Crafted with precision and expertise, this innovative device offers unparalleled performance in a wide range of applications. From automotive to industrial sectors, this microcontroller boasts advanced features like 24-channel ADC, 64K data EEPROM, and 131072 bytes of RAM. Experience seamless connectivity with CAN, I2C, SCI, and SPI interfaces, while enjoying the benefits of 101 I/O lines and 14 PWM channels. Elevate your projects with the TMX5700914ZWTQQ1 and witness the next level of efficiency and reliability in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 1.32 V

The microcontroller can handle higher supply voltages, providing flexibility in power supply options.

Package Shape: SQUARE

The square shape allows for efficient space utilization on circuit boards, optimizing the layout for compact designs.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex operations and calculations efficiently.

ROM Words: 1048576

The large ROM size allows for storing a significant amount of program code, enabling the microcontroller to execute diverse functions.

Maximum Clock Frequency: 80 MHz

The high clock frequency enables fast processing speeds, making the microcontroller suitable for applications requiring quick response times.

RAM Bytes: 131072

The ample RAM capacity allows for efficient data storage and manipulation during program execution, enhancing the performance of the microcontroller.

Analog To Digital Convertors: 24-Ch 12-Bit

The multiple ADC channels with 12-bit resolution provide accurate analog signal conversion, making the microcontroller suitable for applications requiring precise measurements.

Connectivity: CAN(3), I2C, SCI(2), SPI(5)

The multiple connectivity options facilitate communication with external devices, enabling seamless integration into various systems.

Technical Specifications

Microcontrollers TMX5700914ZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B337

Length:

16 mm

No. of I/O Lines:

101

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, SCI(2), SPI(5)

Peripherals:

DMA(16), POR, PWM(14), TIMER(45), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMX5700914ZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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