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TMX5700232APZQQ1

Texas Instruments

TMX5700232APZQQ1 by Texas Instruments

TMX5700232APZQQ1 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, 16K data EEPROM size, and 32768 RAM bytes. Ideal for automotive applications, it features CAN(2), LIN, SPI(3), UART connectivity and peripherals like POR, RTC, TIMER, WDT. Operating temperature ranges from -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,410 parts In-Stock

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4,410

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Digiode

USA . 550 parts In-Stock

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550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 383 parts In-Stock

1+ parts

$10.758

100+ parts

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383

$10.758

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One Stop Electronics

USA . 1,476 parts In-Stock

1+ parts

$24.000

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1,476

$24.000

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Parana Technologies

USA . 1,186 parts In-Stock

1+ parts

$49.854

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1,186

$49.854

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DigiPath Technology Company

USA . 1,532 parts In-Stock

1+ parts

$54.896

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1,532

$54.896

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IDEA Electronic Components Group

UK . 360 parts In-Stock

1+ parts

$56.016

100+ parts

$53.215

1k+ parts

$50.414

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360

$56.016

$53.215

$50.414

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ChromeModa Solutions

Germany . 127 parts In-Stock

1+ parts

$56.016

100+ parts

$45.933

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127

$56.016

$45.933

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Corphita

USA . 4,833 parts In-Stock

1+ parts

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4,833

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Microchip USA

USA . 147 parts In-Stock

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147

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Overview

Experience the power of innovation with the TMX5700232APZQQ1 by Texas Instruments, a high-quality microcontroller that offers exceptional performance and reliability. Designed with cutting-edge technology and built by a trusted manufacturer, this product is ideal for a wide range of automotive applications. With its advanced features and versatile connectivity options, customers can benefit from improved efficiency, enhanced functionality, and seamless integration. Trust in Texas Instruments to deliver excellence and elevate your projects to new heights with the TMX5700232APZQQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and cost-effectiveness to the product.

Surface Mount: YES

Being surface-mountable makes it easier to integrate this microcontroller into various electronic applications, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.32 V

The 1.32 V maximum supply voltage ensures safe operation and prevents potential damage to the microcontroller.

Screening Level: AEC-Q100

With AEC-Q100 screening level, this microcontroller is suitable for automotive applications where high reliability and performance are required.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy placement on PCBs.

Bit Size: 32

The 32-bit architecture of this microcontroller provides enhanced processing power and performance for demanding applications.

No. of Terminals: 100

Having 100 terminals offers versatility in connectivity options and supports a wide range of I/O functions.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style allows for compact design, efficient heat dissipation, and easy component placement on the PCB.

Minimum Supply Voltage: 1.14 V

The 1.14 V minimum supply voltage ensures the microcontroller can operate efficiently in low power scenarios, maximizing energy efficiency.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this microcontroller can withstand high-temperature environments and offers reliable performance in challenging conditions.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures the microcontroller can function effectively in cold environments without any performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections in the long run.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, making it suitable for applications that require interfacing with various sensors and devices.

Terminal Position: QUAD

The quad terminal position enables easy soldering and ensures secure connections on the PCB, enhancing the overall reliability of the product.

ROM Words: 131072

With a ROM capacity of 131072 words, this microcontroller offers ample storage for program code, data, and firmware, supporting complex applications and algorithms.

Maximum Seated Height: 1.6 mm

The maximum seated height of 1.6 mm allows for low-profile design and compatibility with slim devices, making it ideal for compact electronic products.

Width: 14 mm

The 14 mm width provides a compact form factor, making it suitable for space-constrained applications without compromising on performance.

Data EEPROM Size: 16K

The 16K data EEPROM size offers additional non-volatile memory for storing critical data and system parameters, enhancing the versatility and functionality of the microcontroller.

Peripherals: POR, RTC, TIMER, WDT

The inclusion of Power-On Reset, Real-Time Clock, Timer, and Watchdog Timer peripherals enhances the microcontroller's functionality, allowing for precise timekeeping, event scheduling, and system monitoring.

Maximum Time At Peak Reflow Temperature (s): 30

The 30 seconds maximum time at peak reflow temperature ensures reliable and consistent soldering during the assembly process, leading to high-quality and durable connections.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microcontroller can withstand the standard soldering process without any performance degradation or damage.

Length: 14 mm

The 14 mm length complements the compact design of the microcontroller, allowing for easy integration into various electronic devices and systems.

Temperature Grade: AUTOMOTIVE

Being automotive-grade, this microcontroller meets the stringent requirements for temperature resistance, reliability, and performance, making it ideal for automotive applications and harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers high processing speed, low power consumption, and efficient execution of instructions, making it suitable for performance-critical applications.

RAM Bytes: 32768

The 32768 bytes of RAM provide sufficient memory for data storage, processing buffers, and temporary variables, enhancing the microcontroller's capability to handle complex algorithms and tasks.

Technology: CMOS

Using CMOS technology ensures low power consumption, high noise immunity, and reliable operation, making the microcontroller energy-efficient and suitable for battery-powered applications.

Terminal Form: GULL WING

The gull-wing terminal form offers secure soldering connections, easy PCB mounting, and resistance to mechanical stress, ensuring long-term reliability and durability.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16-channel 12-bit ADC converters enables the microcontroller to accurately sample and convert analog signals into digital data with high resolution and precision.

Nominal Supply Voltage: 1.2 V

The 1.2 V nominal supply voltage ensures stable and efficient operation of the microcontroller, maintaining performance and reducing power consumption.

Connectivity: CAN(2), LIN, SPI(3), UART

With multiple connectivity options such as CAN, LIN, SPI, and UART interfaces, the microcontroller can easily communicate with a variety of external devices, enabling seamless integration into diverse systems.

ROM Programmability: FLASH

The Flash ROM programmability allows for easy and quick reprogramming of the microcontroller, facilitating firmware updates, code modifications, and system enhancements without requiring additional components.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch provides compatibility with standard PCB manufacturing processes, simplifying assembly and ensuring accurate soldering of the microcontroller.

Moisture Sensitivity Level (MSL): 3

With MSL 3 rating, the microcontroller is suitable for surface mount reflow soldering processes, offering superior resistance to moisture absorption and ensuring high reliability during manufacturing and operation.

Speed: 80 rpm

With a speed rating of 80 rpm, this microcontroller can handle high-speed data processing tasks efficiently, delivering quick response times and smooth operation in demanding applications.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM allows for efficient storage and execution of program code, improving the microcontroller's performance and responsiveness.

No. of I/O Lines: 45

Having 45 I/O lines enables versatile interfacing with external devices, sensors, and peripherals, enhancing the microcontroller's connectivity and flexibility in diverse applications.

Technical Specifications

Microcontrollers TMX5700232APZQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

45

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

CAN(2), LIN, SPI(3), UART

Peripherals:

POR, RTC, TIMER, WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMX5700232APZQQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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