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TMX5700432APZQQ1

Texas Instruments

TMX5700432APZQQ1 by Texas Instruments

TMX5700432APZQQ1 by Texas Instruments is a 32-bit microcontroller with 16-Ch 12-Bit ADC, 16K Data EEPROM, and 32768 Bytes RAM. It is designed for automotive applications with CAN(2), LIN, MIBSPI connectivity and operates at up to 20 MHz clock frequency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,266 parts In-Stock

1+ parts

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5,266

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Digiode

USA . 2,337 parts In-Stock

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2,337

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Distributors (Availability)

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AZTECH Wire

Italy . 828 parts In-Stock

1+ parts

$14.142

100+ parts

-

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828

$14.142

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One Stop Electronics

USA . 863 parts In-Stock

1+ parts

$25.000

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-

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863

$25.000

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Parana Technologies

USA . 1,342 parts In-Stock

1+ parts

$28.106

100+ parts

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$43.793

10k+ parts

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1,342

$28.106

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$43.793

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ChromeModa Solutions

Germany . 4,106 parts In-Stock

1+ parts

$31.580

100+ parts

$25.896

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10k+ parts

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4,106

$31.580

$25.896

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IDEA Electronic Components Group

UK . 1,693 parts In-Stock

1+ parts

$31.580

100+ parts

$30.001

1k+ parts

$28.422

10k+ parts

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1,693

$31.580

$30.001

$28.422

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Corphita

USA . 4,434 parts In-Stock

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4,434

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DigiPath Technology Company

USA . 2,226 parts In-Stock

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$28.473

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2,226

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$28.473

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Microchip USA

USA . 406 parts In-Stock

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406

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Overview

Unlock the power of cutting-edge technology with the TMX5700432APZQQ1 by Texas Instruments. As a leader in microcontroller manufacturing, Texas Instruments delivers top-quality products that redefine innovation. This microcontroller boasts a wide range of applications in the automotive industry, providing unparalleled performance and reliability. From efficient data processing to seamless connectivity options, this product offers unmatched value and benefits to customers looking to stay ahead in the ever-evolving tech landscape. Experience the advantage of Texas Instruments and take your projects to the next level with the TMX5700432APZQQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Allows for a lightweight and durable package, making the microcontroller suitable for various applications.

Maximum Supply Voltage: 1.32 V

Provides flexibility in power supply options while ensuring safe operation within specified limits.

ADC Channels: YES

Integrated ADC channels allow for analog-to-digital conversion, enabling the microcontroller to interface with sensors and other analog devices.

ROM Words: 393216

Ample memory capacity for storing program instructions and data, enabling complex applications to be executed smoothly.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for efficient instruction execution, enhancing processing speed and performance.

Maximum Clock Frequency: 20 MHz

High clock frequency allows for fast execution of instructions, making the microcontroller suitable for applications requiring real-time processing.

Connectivity: CAN(2), LIN, MIBSPI, SPI(2), UART

Multiple communication interfaces enable the microcontroller to easily communicate with other devices, expanding its compatibility and usability.

Technical Specifications

Microcontrollers TMX5700432APZQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

45

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

CAN(2), LIN, MIBSPI, SPI(2), UART

Peripherals:

POR, PWM, TIMER(2), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMX5700432APZQQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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