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TMX5700914PGEQQ1

Texas Instruments

TMX5700914PGEQQ1 by Texas Instruments

Texas Instruments TMX5700914PGEQQ1 is a 32-bit microcontroller with 1048576 ROM words and 131072 RAM bytes. It operates at up to 80 MHz, has 24-Ch 12-Bit ADC channels, and offers connectivity options like CAN, I2C, SCI, and SPI. Ideal for automotive applications due to AEC-Q100 screening level.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,518 parts In-Stock

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Digiode

USA . 4,971 parts In-Stock

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4,971

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Distributors (Availability)

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AZTECH Wire

Italy . 821 parts In-Stock

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$10.165

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821

$10.165

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One Stop Electronics

USA . 1,374 parts In-Stock

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$32.000

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$32.000

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Parana Technologies

USA . 1,493 parts In-Stock

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$74.052

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DigiPath Technology Company

USA . 1,647 parts In-Stock

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$81.540

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$75.017

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1,647

$81.540

$75.017

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IDEA Electronic Components Group

UK . 1,169 parts In-Stock

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$83.204

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$79.044

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$74.884

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1,169

$83.204

$79.044

$74.884

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ChromeModa Solutions

Germany . 243 parts In-Stock

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$83.204

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$68.227

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243

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Corphita

USA . 302 parts In-Stock

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Microchip USA

USA . 217 parts In-Stock

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Overview

Experience the power of innovation with the TMX5700914PGEQQ1 microcontroller from Texas Instruments. Designed for automotive applications, this high-quality product offers unmatched performance and reliability. With advanced features such as multiple ADC channels, DMA channels, and a wide range of connectivity options, this microcontroller is perfect for a variety of automotive systems. Whether you're working on engine control units or infotainment systems, the TMX5700914PGEQQ1 delivers exceptional value and efficiency. Trust Texas Instruments for cutting-edge technology that meets all your automotive needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options for the microcontroller.

Bit Size: 32

A larger bit size allows for handling more complex data and instructions, making the microcontroller suitable for advanced tasks.

ADC Channels: YES

The presence of Analog to Digital Converter channels enables the microcontroller to interface with analog sensors or devices.

ROM Words: 1048576

With a large ROM size, the microcontroller can store a significant amount of program data or instructions.

RAM Bytes: 131072

The generous amount of RAM allows for efficient data processing and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the microcontroller.

Connectivity: CAN(3), I2C, SCI(2), SPI(4)

Multiple connectivity options provide versatility in interfacing with different communication protocols and devices.

Technical Specifications

Microcontrollers TMX5700914PGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

64

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, SCI(2), SPI(4)

Peripherals:

DMA(16), POR, PWM(14), TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMX5700914PGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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