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TMX5700714PZQQ1

Texas Instruments

TMX5700714PZQQ1 by Texas Instruments

TMX5700714PZQQ1 by Texas Instruments is a 32-bit microcontroller with 786432 ROM words and 131072 RAM bytes. It features 16-Ch 12-Bit ADC channels, 8 PWM channels, and connectivity options like CAN, I2C, LIN, MIBSPI, SCI, SPI, UART. Ideal for automotive applications due to AEC-Q100 screening level and operating temperature range of -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,770 parts In-Stock

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Vyrian

USA . 3,310 parts In-Stock

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One Stop Electronics

USA . 1,332 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 374 parts In-Stock

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$9.457

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Parana Technologies

USA . 1,854 parts In-Stock

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$29.088

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$2,701.250

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$26.179

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DigiPath Technology Company

USA . 1,808 parts In-Stock

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$32.029

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$29.467

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ChromeModa Solutions

Germany . 6,807 parts In-Stock

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$32.683

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$26.800

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IDEA Electronic Components Group

UK . 738 parts In-Stock

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$32.683

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$31.049

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$29.415

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Component Stockers USA

USA . 372 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the TMX5700714PZQQ1 microcontroller. Ideal for automotive applications, this advanced device offers a range of peripherals including PWM, timers, and ADC channels. With a maximum clock frequency of 80 MHz and a wide range of connectivity options, this microcontroller provides exceptional performance and versatility. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs with unmatched precision and efficiency. Elevate your projects with the TMX5700714PZQQ1 microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-lasting performance.

Maximum Supply Voltage: 1.32 V

Allows for a wide range of input voltage, making it versatile for different applications.

Package Shape: SQUARE

Square shape provides ease of mounting and efficient use of board space.

Bit Size: 32

High bit size enhances processing power and capability of the microcontroller.

ROM Words: 786432

Large ROM capacity allows for storing a significant amount of program data.

Maximum Clock Frequency: 80 MHz

High clock frequency enables fast processing and response times.

RAM Bytes: 131072

Large RAM capacity allows for efficient temporary data storage during operations.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple ADC channels with high resolution enhance analog signal processing capability.

Connectivity: CAN(3), I2C, LIN, MIBSPI(2), SCI, SPI, UART

Versatile connectivity options allow for easy integration with various communication protocols.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and dedicated peripherals optimize performance and efficiency of the microcontroller.

Technical Specifications

Microcontrollers TMX5700714PZQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

45

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

786432

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN, MIBSPI(2), SCI, SPI, UART

Peripherals:

CAP(4), DMA(16), QEP, POR, PWM(8), TIMER(21)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMX5700714PZQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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