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TMX5702124APGEQQ1

Texas Instruments

TMX5702124APGEQQ1 by Texas Instruments

TMX5702124APGEQQ1 by Texas Instruments is a 32-bit microcontroller with 80 MHz clock frequency, suitable for industrial applications. It features ADC and DMA channels, along with PWM support. Operating temperature ranges from -40 to 105°C, making it ideal for various automotive electronics and control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,056 parts In-Stock

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Digiode

USA . 4,718 parts In-Stock

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One Stop Electronics

USA . 1,194 parts In-Stock

1+ parts

$18.000

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$18.000

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AZTECH Wire

Italy . 303 parts In-Stock

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$18.212

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Parana Technologies

USA . 1,505 parts In-Stock

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$44.226

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$44.226

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IDEA Electronic Components Group

UK . 537 parts In-Stock

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$49.692

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$47.207

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$44.723

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537

$49.692

$47.207

$44.723

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ChromeModa Solutions

Germany . 448 parts In-Stock

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$49.692

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$40.747

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448

$49.692

$40.747

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Corphita

USA . 2,664 parts In-Stock

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2,664

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DigiPath Technology Company

USA . 718 parts In-Stock

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$44.802

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Overview

Unlock the potential of your projects with the TMX5702124APGEQQ1 from Texas Instruments, a leading manufacturer in the industry. This powerful microcontroller offers unparalleled performance and reliability for a wide range of applications. With advanced features like ADC and DMA channels, PWM capabilities, and high clock frequency, this versatile device is perfect for industrial-grade projects. Trust in Texas Instruments to deliver top-quality products that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good physical protection for the microcontroller, ensuring durability and longevity.

Surface Mount: YES

Enables easy and efficient installation on PCBs, reducing assembly time and costs.

Maximum Supply Voltage: 1.32 V

Optimal voltage range for stable and reliable operation of the microcontroller.

Screening Level: AEC-Q100

Indicates that the microcontroller meets automotive industry quality standards, ensuring high performance in harsh environments.

Package Shape: SQUARE

Allows for more efficient use of space on PCBs and easier integration into circuit designs.

Bit Size: 32

Offers sufficient data processing capability for various applications, providing versatility and performance.

No. of Terminals: 144

Provides ample connectivity options for interfacing with other components and peripherals in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances overall compactness and efficiency of the microcontroller package for space-constrained applications.

Minimum Supply Voltage: 1.14 V

Ensures stable operation even at lower voltage levels, increasing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 105 °C

Suitable for use in industrial environments with higher temperature requirements, ensuring reliability and performance under harsh conditions.

Minimum Operating Temperature: -40 °C

Allows the microcontroller to operate in extreme cold conditions, making it suitable for a wide range of applications.

ADC Channels: YES

Enables analog-to-digital conversion capabilities, essential for interfacing with sensors and other analog devices in the system.

DMA Channels: YES

Supports direct memory access for efficient data transfer and processing, improving overall system performance.

Terminal Position: QUAD

Facilitates easier and organized PCB layout and soldering of the microcontroller.

Maximum Seated Height: 1.6 mm

Low profile design allows for compact and streamlined system design, especially in space-constrained applications.

Width: 20 mm

Compact form factor, suitable for applications where space is limited.

Maximum Clock Frequency: 80 MHz

High clock frequency enables fast data processing and responsiveness, making the microcontroller suitable for real-time applications.

Length: 20 mm

Compact form factor, suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions, ensuring reliability and performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and fast data processing capabilities, suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance and efficiency.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connection to the PCB, ensuring stable operation.

Nominal Supply Voltage: 1.2 V

Optimal voltage level for efficient and stable operation of the microcontroller.

PWM Channels: YES

Supports pulse-width modulation for precise control of connected devices, enhancing system functionality and performance.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and quick updates to the firmware, ensuring flexibility and adaptability of the system.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density integration on PCBs, saving space and facilitating compact system designs.

Speed: 160 rpm

High speed capability for data processing and execution of instructions, suitable for performance-critical applications.

No. of I/O Lines: 4

Sufficient I/O lines for interfacing with external devices and peripherals, providing flexibility and connectivity options.

Technical Specifications

Microcontrollers TMX5702124APGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

4

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMX5702124APGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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