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TMX5700332PZQQ1R

Texas Instruments

TMX5700332PZQQ1R by Texas Instruments

TMX5700332PZQQ1R by Texas Instruments is a 32-bit microcontroller with 100 terminals, operating at up to 20 MHz. Ideal for automotive applications, it features ADC and DMA channels, PWM support, and operates b/w -40°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,398 parts In-Stock

1+ parts

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3,398

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Digiode

USA . 2,542 parts In-Stock

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2,542

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,361 parts In-Stock

1+ parts

$9.000

100+ parts

-

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1,361

$9.000

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AZTECH Wire

Italy . 675 parts In-Stock

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$12.822

100+ parts

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675

$12.822

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Parana Technologies

USA . 2,088 parts In-Stock

1+ parts

$65.379

100+ parts

$6,071.469

1k+ parts

$58.841

10k+ parts

-

2,088

$65.379

$6,071.469

$58.841

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DigiPath Technology Company

USA . 2,262 parts In-Stock

1+ parts

$71.991

100+ parts

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1k+ parts

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2,262

$71.991

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ChromeModa Solutions

Germany . 3,179 parts In-Stock

1+ parts

$73.460

100+ parts

$60.237

1k+ parts

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3,179

$73.460

$60.237

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IDEA Electronic Components Group

UK . 1,243 parts In-Stock

1+ parts

$73.460

100+ parts

$69.787

1k+ parts

$66.114

10k+ parts

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1,243

$73.460

$69.787

$66.114

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Corphita

USA . 3,417 parts In-Stock

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3,417

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Overview

Unlock the power of cutting-edge technology with the TMX5700332PZQQ1R microcontroller from Texas Instruments. Designed with precision and expertise, this microcontroller offers unmatched reliability and performance in a variety of applications. From automotive to industrial automation, this device is the perfect solution for your next project. Experience seamless operation and enhanced efficiency with the TMX5700332PZQQ1R, setting new standards in quality and innovation. Elevate your designs with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides good thermal stability and protection for the internal components.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V ensures that the microcontroller operates within safe voltage limits, extending its lifespan and reliability.

Package Shape: SQUARE

A square package shape is ideal for space-saving designs and allows for efficient placement on circuit boards.

Bit Size: 32

A 32-bit microcontroller offers higher processing power, allowing for more complex operations and faster execution of tasks.

No. of Terminals: 100

Having a larger number of terminals provides more connectivity options and flexibility in designing circuits and interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style allows for a compact and low-profile design, making it suitable for applications where space is limited.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures that the microcontroller can operate reliably even under low power conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and operate reliably in demanding applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 125°C ensures that the microcontroller can function in extreme temperature conditions.

ADC Channels: YES

Analog-to-digital converter (ADC) channels allow the microcontroller to interface with analog sensors and signals, making it suitable for a wide range of applications.

DMA Channels: YES

Direct memory access (DMA) channels enable efficient data transfer between peripherals and memory, enhancing the overall performance of the microcontroller.

Terminal Position: QUAD

Quad terminal position provides a balanced layout for effective signal routing and connectivity, enabling optimal performance in circuit designs.

Maximum Seated Height: 1.6 mm

A low maximum seated height allows for a compact overall design, making this microcontroller suitable for slim and space-constrained applications.

Width: 14 mm

With a compact width of 14 mm, this microcontroller can be easily integrated into small form factor devices without sacrificing performance.

Maximum Clock Frequency: 20 MHz

A high maximum clock frequency of 20 MHz enables fast processing speeds and efficient data handling, making this microcontroller suitable for high-speed applications.

Length: 14 mm

The compact length of 14 mm allows for easy placement and integration of the microcontroller into tight spaces, maximizing design flexibility.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets the stringent temperature and reliability requirements of automotive electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC-based microcontroller architecture provides efficient processing and low power consumption, making it suitable for battery-powered devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making this microcontroller energy-efficient and versatile.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and mounting onto circuit boards, ensuring reliable electrical connections and mechanical stability.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V provides a stable operating voltage for the microcontroller, ensuring consistent performance and reliability.

PWM Channels: YES

Pulse-width modulation (PWM) channels enable precise control of analog signals, making this microcontroller suitable for applications requiring accurate voltage regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible reprogramming of the microcontroller, enabling firmware updates and customization of functionality.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5 mm provides high-density packaging options and facilitates miniaturization of circuit designs, making this microcontroller suitable for compact devices.

Speed: 80 rpm

With a speed of 80 revolutions per minute (rpm), this microcontroller can efficiently process and respond to input signals, ensuring smooth operation in various applications.

No. of I/O Lines: 45

Having 45 I/O lines offers ample connectivity options for interfacing with external devices and sensors, making this microcontroller versatile and suitable for a wide range of applications.

Technical Specifications

Microcontrollers TMX5700332PZQQ1R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

45

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMX5700332PZQQ1R Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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