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TMS320F2806GGMA

Texas Instruments

TMS320F2806GGMA by Texas Instruments

TMS320F2806GGMA by Texas Instruments is a 32-bit DSP with 100 terminals, operating at max 100 MHz. Ideal for industrial applications, it features low power mode, internal bus architecture, and fixed-point format for efficient signal processing tasks.

Median Price

$9.250

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$9.250

1k+ parts

$8.280

10k+ parts

$7.790

3

-

$9.250

$8.280

$7.790

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,814 parts In-Stock

1+ parts

$9.756

100+ parts

-

1k+ parts

-

10k+ parts

-

3,814

$9.756

-

-

-

Vyrian

USA . 8,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,795

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,657 parts In-Stock

1+ parts

$9.243

100+ parts

-

1k+ parts

-

10k+ parts

-

3,657

$9.243

-

-

-

Component Stockers USA

USA . 2 parts In-Stock

1+ parts

$10.390

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$10.390

-

-

-

AZTECH Wire

Italy . 860 parts In-Stock

1+ parts

$14.450

100+ parts

-

1k+ parts

-

10k+ parts

-

860

$14.450

-

-

-

Corohmni

South Africa . 2,086 parts In-Stock

1+ parts

$36.611

100+ parts

-

1k+ parts

-

10k+ parts

-

2,086

$36.611

-

-

-

Parana Technologies

USA . 1,402 parts In-Stock

1+ parts

$40.706

100+ parts

-

1k+ parts

-

10k+ parts

-

1,402

$40.706

-

-

-

DigiPath Technology Company

USA . 2,305 parts In-Stock

1+ parts

$44.822

100+ parts

-

1k+ parts

-

10k+ parts

-

2,305

$44.822

-

-

-

Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$45.130

100+ parts

$41.068

1k+ parts

$37.007

10k+ parts

-

15

$45.130

$41.068

$37.007

-

ChromeModa Solutions

Germany . 6,893 parts In-Stock

1+ parts

$45.737

100+ parts

$37.504

1k+ parts

-

10k+ parts

-

6,893

$45.737

$37.504

-

-

IDEA Electronic Components Group

UK . 670 parts In-Stock

1+ parts

$45.737

100+ parts

$43.450

1k+ parts

$41.163

10k+ parts

-

670

$45.737

$43.450

$41.163

-

Microchip USA

USA . 371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

371

-

-

-

-

Overview

Experience the power of cutting-edge technology with the TMS320F2806GGMA by Texas Instruments. As a leading manufacturer in the digital signal processors (DSPs) category, Texas Instruments delivers top-quality products that are perfect for a wide range of applications. With a focus on value and innovation, this product offers customers unparalleled performance, efficiency, and reliability. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 1.89 V

Optimal voltage level for reliable performance without risking damage to the DSP.

Package Shape: SQUARE

Compact design for space-saving and efficient PCB layout.

Bit Size: 32

Offers high processing power and capability for complex digital signal processing tasks.

Power Supplies (V): 1.8,3.3

Supports different power supply options for flexibility in system design and integration.

No. of Terminals: 100

Sufficient terminals for connecting with external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhanced reliability and stability with a specialized packaging style suitable for industrial applications.

Minimum Supply Voltage: 1.71 V

Ensures a reliable operation at lower voltage levels for energy efficiency.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ideal for harsh environments.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold conditions without compromising performance.

Terminal Finish: TIN LEAD

Provides a reliable connection and solder joint for long-term use.

Terminal Position: BOTTOM

Facilitates easy PCB layout and integration with other components.

Maximum Seated Height: 1.4 mm

Low profile design for compact and space-saving system designs.

RAM Words: 10240

Sufficient memory capacity for storing and processing data efficiently.

Width: 10 mm

Compact width for efficient layout and space-saving on PCBs.

Boundary Scan: YES

Enables efficient testing and debugging of the DSP during production and maintenance.

Maximum Clock Frequency: 100 MHz

High clock frequency for fast and efficient signal processing.

Maximum Time At Peak Reflow Temperature (s): 20

Suitable reflow temperature profile for reliable soldering and assembly.

Peak Reflow Temperature °C: 220

Optimal temperature for soldering without damaging the DSP.

Internal Bus Architecture: MULTIPLE

Efficient data transfer and processing with multiple bus architectures.

Length: 10 mm

Compact length for space-saving and efficient PCB layout.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with reliability in varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile functionality as a digital signal processor and other peripheral ICs for diverse applications.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: BALL

Ball terminal form for easy and reliable soldering connections.

Nominal Supply Voltage: 1.8 V

Stable supply voltage for consistent performance and reliability.

Terminal Pitch: 0.8 mm

Fine terminal pitch for compact and space-saving PCB layout.

Format: FIXED POINT

Fixed-point format for efficient and precise signal processing.

Moisture Sensitivity Level (MSL): 3

Withstands moderate moisture levels for reliable operation in different environments.

Low Power Mode: YES

Energy-efficient low power mode for prolonging battery life and reducing power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2806GGMA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e0

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

10240

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2806GGMA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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