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TMS3139JC

Texas Instruments

TMS3139JC by Texas Instruments

TMS3139JC by Texas Instruments is a MOS digital shift register with 132 bits and 9 functions. Operating at temperatures from -25°C to 85°C, it has a max frequency of 1.5MHz. Ideal for applications requiring precise data shifting in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,408 parts In-Stock

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7,408

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Digiode

USA . 1,898 parts In-Stock

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1,898

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Distributors (Availability)

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One Stop Electronics

USA . 305 parts In-Stock

1+ parts

$7.000

100+ parts

-

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305

$7.000

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AZTECH Wire

Italy . 467 parts In-Stock

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$8.778

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467

$8.778

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Parana Technologies

USA . 277 parts In-Stock

1+ parts

$20.787

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$20.942

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277

$20.787

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$20.942

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DigiPath Technology Company

USA . 1,815 parts In-Stock

1+ parts

$22.889

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$21.058

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1,815

$22.889

$21.058

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IDEA Electronic Components Group

UK . 2,279 parts In-Stock

1+ parts

$23.356

100+ parts

$22.188

1k+ parts

$21.020

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2,279

$23.356

$22.188

$21.020

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ChromeModa Solutions

Germany . 2,028 parts In-Stock

1+ parts

$23.356

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$19.152

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2,028

$23.356

$19.152

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Corphita

USA . 2,973 parts In-Stock

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Overview

Unlock the power of innovation with the TMS3139JC by Texas Instruments. This digital shift register boasts unmatched quality and reliability, making it a top choice for a variety of applications. With its 132-bit capacity and 9 functions, this product offers unparalleled value to customers seeking high-performance solutions. From industrial automation to consumer electronics, the TMS3139JC delivers the benefits and advantages you need to stay ahead in today's competitive market. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal conductivity and stability, ensuring reliable operation of the shift register even at high temperatures.

No. of Functions: 9

Having 9 functions allows for versatile use of the shift register in various applications, offering more flexibility in circuit design.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate the shift register into different electronic systems or circuits.

No. of Bits: 132

132 bits provide a high level of data processing capability for handling complex digital signals efficiently.

Power Supplies (V): 5,-12

Support for multiple power supply voltages (5V and -12V) allows for compatibility with different electronics setups, enhancing versatility.

No. of Terminals: 24

Having 24 terminals facilitates easy connections with other components, simplifying integration into larger electronic systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the shift register can withstand demanding environmental conditions, improving overall reliability.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows the shift register to function in colder environments without issue, increasing its usability range.

Maximum Frequency At Nominal Supply: 1500000 Hz

High maximum frequency capability enables the shift register to process data quickly and efficiently, making it suitable for high-speed applications.

Technology: MOS

MOS technology offers low power consumption and high speed performance, making the shift register energy-efficient and reliable in operation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection, preventing accidental disconnections and ensuring stable operation of the shift register.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm allows for easy compatibility with common electronic components and circuit boards, simplifying integration.

Technical Specifications

Digital Shift Registers TMS3139JC attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

Maximum Frequency At Nominal Supply:

1500000 Hz

No. of Bits:

132

No. of Functions:

9

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5,-12

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3139JC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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