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TMS3101LC

Texas Instruments

TMS3101LC by Texas Instruments

TMS3101LC by Texas Instruments is a MOS technology digital shift register with 100 bits. It has 2 functions, operates b/w -25°C to 85°C, and comes in a cylindrical metal package with 10 terminals. Ideal for applications requiring precise data shifting and storage in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,530 parts In-Stock

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Digiode

USA . 1,062 parts In-Stock

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1,062

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Electronic Expediters

USA . 67 parts In-Stock

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67

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ACDS - Activité Composants Distribution Service

France . 22 parts In-Stock

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22

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Distributors (Availability)

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AZTECH Wire

Italy . 661 parts In-Stock

1+ parts

$9.571

100+ parts

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661

$9.571

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Parana Technologies

USA . 229 parts In-Stock

1+ parts

$14.447

100+ parts

$1,341.657

1k+ parts

$13.003

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229

$14.447

$1,341.657

$13.003

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DigiPath Technology Company

USA . 1,989 parts In-Stock

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$15.908

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1,989

$15.908

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IDEA Electronic Components Group

UK . 2,115 parts In-Stock

1+ parts

$16.233

100+ parts

$15.421

1k+ parts

$14.610

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2,115

$16.233

$15.421

$14.610

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ChromeModa Solutions

Germany . 194 parts In-Stock

1+ parts

$16.233

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$13.311

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194

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$13.311

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One Stop Electronics

USA . 429 parts In-Stock

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$58.000

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429

$58.000

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Corphita

USA . 1,444 parts In-Stock

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1,444

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Overview

Unlock the power of innovation with the TMS3101LC by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital shift registers that are versatile and reliable. With 100 bits and 2 functions packed into a sleek cylindrical package, this product is perfect for a wide range of applications. From automotive to industrial automation, the TMS3101LC offers unmatched value, benefits, and advantages to customers looking for cutting-edge solutions. Upgrade your technology with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body material provides better protection and durability, ensuring the shift register can withstand harsh environments and handling.

No. of Functions: 2

Having 2 functions increases the versatility and functionality of the shift register, allowing for more complex operations to be performed.

Package Shape: ROUND

Round package shape helps in efficient integration and installation of the shift register in various electronic setups, saving space and providing ease of connectivity.

No. of Bits: 100

Having 100 bits allows for handling larger amounts of data at once, making the shift register suitable for applications requiring high data processing capabilities.

No. of Terminals: 10

Having 10 terminals enables easy connection to other components and peripherals, enhancing the flexibility and compatibility of the shift register.

Package Style (Meter): CYLINDRICAL

The cylindrical package style provides a compact form factor, making it ideal for space-constrained applications where size matters.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the shift register can perform reliably in demanding conditions without overheating.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25°C guarantees the shift register can function effectively even in cold environments, offering versatility in operating conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and organized wiring connections, streamlining the setup process and improving overall user experience.

Technology: MOS

Using MOS technology offers high speed, low power consumption, and enhanced reliability, making the shift register efficient and suitable for various applications.

Terminal Form: WIRE

Wire terminal form simplifies the connections and ensures secure attachment, reducing the risk of loose connections and signal interference.

Technical Specifications

Digital Shift Registers TMS3101LC attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

O-MBCY-W10

No. of Bits:

100

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

METAL

Package Equivalence Code:

CAN10,.23

Package Shape:

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3101LC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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