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TMS3102LC

Texas Instruments

TMS3102LC by Texas Instruments

TMS3102LC by Texas Instruments is an 80-bit MOS digital shift register with 10 terminals in a cylindrical metal package. It operates b/w -25°C to 85°C, suitable for applications requiring high-speed data shifting and storage in industrial electronics and communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,444 parts In-Stock

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7,444

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Digiode

USA . 1,273 parts In-Stock

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1,273

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Manotoh

Italy . 51 parts In-Stock

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51

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Distributors (Availability)

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AZTECH Wire

Italy . 508 parts In-Stock

1+ parts

$6.098

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508

$6.098

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Parana Technologies

USA . 1,201 parts In-Stock

1+ parts

$13.012

100+ parts

$1,208.343

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$11.711

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1,201

$13.012

$1,208.343

$11.711

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DigiPath Technology Company

USA . 469 parts In-Stock

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$14.328

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469

$14.328

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ChromeModa Solutions

Germany . 5,946 parts In-Stock

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$14.620

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$11.988

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5,946

$14.620

$11.988

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IDEA Electronic Components Group

UK . 1,961 parts In-Stock

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$14.620

100+ parts

$13.889

1k+ parts

$13.158

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1,961

$14.620

$13.889

$13.158

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One Stop Electronics

USA . 531 parts In-Stock

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$48.000

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531

$48.000

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Corphita

USA . 2,439 parts In-Stock

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2,439

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Overview

Elevate your digital shift register game with the TMS3102LC by Texas Instruments. This high-quality product boasts top-notch manufacturing from a trusted industry leader, ensuring reliability and performance. Designed for a multitude of applications, this versatile device offers customers unparalleled value, benefits, and advantages. Experience seamless functionality and efficiency with the TMS3102LC, setting you ahead of the competition in the digital shift register category.

Feature Benefit Bullets

Package Body Material: METAL

Metal body provides durability and protection to the internal components, making the product suitable for rugged environments and long-term usage.

No. of Functions: 2

Having 2 functions allows for versatility in operations and increased functionality, making the product more versatile and adaptable to different applications.

Package Shape: ROUND

Round shape facilitates easy installation and fitting in compact spaces, making the product convenient and ergonomic to use.

No. of Bits: 80

With 80 bits, the product can handle a large amount of data efficiently and accurately, making it suitable for complex data processing tasks.

No. of Terminals: 10

Having 10 terminals allows for easy connectivity and integration with other devices, enhancing the product's overall functionality and usability.

Package Style (Meter): CYLINDRICAL

The cylindrical package style provides a compact and space-saving design, making the product ideal for applications where space is limited.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the product can withstand high temperatures without performance degradation, enhancing its reliability in various environments.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25°C allows the product to operate effectively even in cold environments, increasing its versatility and applicability.

Terminal Position: BOTTOM

Bottom terminal position enables easy and efficient connectivity with other components, reducing installation time and effort required for integration.

Technology: MOS

MOS technology offers high-speed operation and low power consumption, making the product efficient and reliable for various digital applications.

Terminal Form: WIRE

Wire terminal form provides a secure and reliable connection, ensuring stable and uninterrupted performance of the product in demanding conditions.

Technical Specifications

Digital Shift Registers TMS3102LC attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

O-MBCY-W10

No. of Bits:

80

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

METAL

Package Equivalence Code:

CAN10,.23

Package Shape:

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3102LC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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