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TMS3002LR

Texas Instruments

TMS3002LR by Texas Instruments

TMS3002LR by Texas Instruments is a MOS technology digital shift register with 50 bits and 10 terminals. It operates b/w -55°C to 85°C, housed in a cylindrical metal package. Ideal for applications requiring precise data shifting and control in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,039 parts In-Stock

1+ parts

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8,039

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Digiode

USA . 1,006 parts In-Stock

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1,006

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GES GmbH

Germany . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 574 parts In-Stock

1+ parts

$13.867

100+ parts

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574

$13.867

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Parana Technologies

USA . 52 parts In-Stock

1+ parts

$19.601

100+ parts

-

1k+ parts

$19.597

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52

$19.601

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$19.597

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DigiPath Technology Company

USA . 654 parts In-Stock

1+ parts

$21.584

100+ parts

$19.857

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654

$21.584

$19.857

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IDEA Electronic Components Group

UK . 1,472 parts In-Stock

1+ parts

$22.024

100+ parts

$20.923

1k+ parts

$19.822

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1,472

$22.024

$20.923

$19.822

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ChromeModa Solutions

Germany . 1,207 parts In-Stock

1+ parts

$22.024

100+ parts

$18.060

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1,207

$22.024

$18.060

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One Stop Electronics

USA . 1,364 parts In-Stock

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$32.000

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1,364

$32.000

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Corphita

USA . 3,088 parts In-Stock

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3,088

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Overview

Experience the superior quality and reliability of the TMS3002LR by Texas Instruments, a leading manufacturer in the industry. This digital shift register offers endless applications in various electronic devices, providing customers with unparalleled value and benefits. With its advanced technology and durable construction, this product ensures optimal performance and efficiency. Upgrade your projects with the TMS3002LR and discover the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: METAL

Metal body provides durability and ensures good heat dissipation, making the product suitable for industrial applications.

No. of Functions: 2

Having 2 functions allows for more versatility and flexibility in applications that require multiple operations.

Package Shape: ROUND

Round shape offers efficient use of space and allows for easy integration into various systems or circuits.

No. of Bits: 50

With 50 bits, this shift register offers high data storage capacity, suitable for handling complex data processing tasks.

No. of Terminals: 10

Having 10 terminals provides ample connectivity options for interfacing with other components or devices.

Package Style: CYLINDRICAL

Cylindrical package style allows for easy mounting and installation in compact spaces, ideal for applications with limited room.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance under varying environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the product to function in extreme cold environments, increasing its versatility.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and enables easier soldering during assembly.

Technology: MOS

MOS technology offers high speed and low power consumption, making the shift register efficient and suitable for energy-sensitive applications.

Terminal Form: WIRE

Wire terminals provide secure connections and easy integration with other components, facilitating installation and maintenance.

Technical Specifications

Digital Shift Registers TMS3002LR attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

O-MBCY-W10

No. of Bits:

50

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

METAL

Package Equivalence Code:

CAN10,.23

Package Shape:

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3002LR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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