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TMS3000LR

Texas Instruments

TMS3000LR by Texas Instruments

TMS3000LR by Texas Instruments is a MOS technology digital shift register with 25 bits. It features a cylindrical metal package with 10 terminals and operates b/w -55°C to 85°C. Ideal for applications requiring precise data shifting in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,637 parts In-Stock

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Digiode

USA . 3,146 parts In-Stock

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3,146

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Distributors (Availability)

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AZTECH Wire

Italy . 558 parts In-Stock

1+ parts

$5.732

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558

$5.732

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One Stop Electronics

USA . 1,386 parts In-Stock

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$7.000

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1,386

$7.000

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Parana Technologies

USA . 1,609 parts In-Stock

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$21.855

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$22.337

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1,609

$21.855

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$22.337

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DigiPath Technology Company

USA . 318 parts In-Stock

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$24.065

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$22.140

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318

$24.065

$22.140

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ChromeModa Solutions

Germany . 1,373 parts In-Stock

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$24.556

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$20.136

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$24.556

$20.136

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IDEA Electronic Components Group

UK . 628 parts In-Stock

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$24.556

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$23.328

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$22.100

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628

$24.556

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$22.100

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Corphita

USA . 1,803 parts In-Stock

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Overview

Experience the superior quality and precision engineering of the TMS3000LR by Texas Instruments, a leading manufacturer in the industry. This digital shift register offers endless possibilities for applications in various fields, providing customers with unmatched value and performance. With 25 bits and 2 functions, this product is designed to meet your specific needs with ease. Invest in the best with Texas Instruments and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: METAL

The use of metal in the package body provides durability and protection for the internal components of the shift register, making it suitable for industrial and harsh environments.

No. of Functions: 2

Having multiple functions in a single device allows for greater flexibility and versatility in digital signal processing applications.

Package Shape: ROUND

The round package shape can be easier to integrate into circular or cylindrical systems, making it a good choice for certain design requirements.

No. of Bits: 25

With 25 bits, this shift register can handle a larger amount of data in a single operation, suitable for applications that require processing of multiple bits simultaneously.

No. of Terminals: 10

The 10 terminals provide ample connectivity options for interfacing with other components or systems, enhancing the versatility of the shift register.

Package Style (Meter): CYLINDRICAL

The cylindrical package style is compact and space-efficient, making it easier to integrate into tight spaces or densely packed electronic assemblies.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this shift register can withstand elevated temperatures and operate reliably in demanding thermal conditions.

Minimum Operating Temperature: -55 °C

The shift register can also operate at low temperatures down to -55°C, expanding its range of environmental suitability for various applications.

Terminal Position: BOTTOM

The bottom terminal position can simplify PCB layout and assembly, making it easier to integrate the shift register into electronic systems.

Technology: MOS

Utilizing MOS technology can provide low power consumption and fast switching speeds, making the shift register efficient and suitable for high-speed digital applications.

Terminal Form: WIRE

Wire terminals offer easy and reliable connectivity options, allowing for secure connections and ease of installation in various electronic systems.

Technical Specifications

Digital Shift Registers TMS3000LR attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

O-MBCY-W10

No. of Bits:

25

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

METAL

Package Equivalence Code:

CAN10,.23

Package Shape:

Package Style (Meter):

CYLINDRICAL

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

TMS3000LR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-430-7290, 5962004307290

NIIN

004307290

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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