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TMS3003LR

Texas Instruments

TMS3003LR by Texas Instruments

TMS3003LR by Texas Instruments is a MOS technology digital shift register with 100 bits. It comes in a cylindrical metal package with 10 terminals and operates b/w -55°C to 85°C. Ideal for applications requiring precise data shifting and control functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,180 parts In-Stock

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5,180

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Digiode

USA . 3,565 parts In-Stock

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3,565

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Prism Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 189 parts In-Stock

1+ parts

$12.000

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189

$12.000

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Parana Technologies

USA . 1,657 parts In-Stock

1+ parts

$18.068

100+ parts

-

1k+ parts

$18.214

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1,657

$18.068

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$18.214

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AZTECH Wire

Italy . 289 parts In-Stock

1+ parts

$18.429

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289

$18.429

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DigiPath Technology Company

USA . 277 parts In-Stock

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$19.895

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277

$19.895

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ChromeModa Solutions

Germany . 1,442 parts In-Stock

1+ parts

$20.301

100+ parts

$16.647

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1,442

$20.301

$16.647

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IDEA Electronic Components Group

UK . 911 parts In-Stock

1+ parts

$20.301

100+ parts

$19.286

1k+ parts

$18.271

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911

$20.301

$19.286

$18.271

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Corphita

USA . 4,467 parts In-Stock

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4,467

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TMS3003LR digital shift register. This cutting-edge product offers endless possibilities in various applications, from industrial automation to consumer electronics. With its advanced technology and innovative design, the TMS3003LR delivers exceptional performance while maximizing efficiency. Trust Texas Instruments for top-notch solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: METAL

The metal package body provides durability and protection for the internal components, ensuring the shift registers can withstand harsh operating conditions.

No. of Functions: 2

Having 2 functions allows for versatile functionality in a single component, making it a cost-effective and space-saving solution for applications requiring multiple functions.

Package Shape: ROUND

The round package shape provides ease of handling and installation, eliminating sharp corners that could cause damage during the assembly process.

No. of Bits: 100

With 100 bits, this shift register can handle a significant amount of data processing, making it suitable for demanding applications that require high-speed and large data transfers.

No. of Terminals: 10

Having 10 terminals allows for easy connectivity and integration into existing circuitry, providing flexibility in design and installation.

Package Style (Meter): CYLINDRICAL

The cylindrical package style enhances thermal performance by providing efficient heat dissipation, ensuring stable operation of the shift registers even under high operating temperatures.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the shift registers to be used in a wide range of environments without risk of overheating, ensuring reliable performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures that the shift registers can function effectively even in extreme cold conditions, making them suitable for use in various temperature environments.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, making installation and connection of the shift registers more convenient and efficient.

Technology: MOS

The MOS technology used in these shift registers offers low power consumption and high speed operation, making them energy-efficient and ideal for applications requiring fast data processing.

Terminal Form: WIRE

The wire terminal form provides secure connections and ease of soldering, ensuring reliable electrical contact and preventing signal loss, making these shift registers a reliable choice for electronic circuits.

Technical Specifications

Digital Shift Registers TMS3003LR attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

O-MBCY-W10

No. of Bits:

100

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

METAL

Package Equivalence Code:

CAN10,.23

Package Shape:

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3003LR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-556-4590, 5962005564590, 5962-00-274-2278, 5962002742278, 5962-00-689-1637, 5962006891637

NIIN

005564590, 002742278, 006891637

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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