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TMS3113NC

Texas Instruments

TMS3113NC by Texas Instruments

TMS3113NC by Texas Instruments is a digital shift register with 133 bits and 16 terminals. It operates b/w -25°C to 85°C, making it suitable for various applications requiring MOS technology. The package style is in-line rectangular shape made of plastic/epoxy material.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 4,639 parts In-Stock

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Vyrian

USA . 3,134 parts In-Stock

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Electronic Expediters

USA . 176 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 67 parts In-Stock

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AZTECH Wire

Italy . 659 parts In-Stock

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$6.145

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Parana Technologies

USA . 525 parts In-Stock

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$17.925

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$18.091

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525

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ChromeModa Solutions

Germany . 6,737 parts In-Stock

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$20.140

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$16.515

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IDEA Electronic Components Group

UK . 233 parts In-Stock

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$20.140

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$19.133

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$18.126

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One Stop Electronics

USA . 817 parts In-Stock

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$33.000

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Corphita

USA . 3,834 parts In-Stock

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DigiPath Technology Company

USA . 1,167 parts In-Stock

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$18.158

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Assy Fe

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Overview

Upgrade your digital shift register game with the TMS3113NC by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliability and performance in every component they produce. The TMS3113NC offers 133 bits of functionality, making it a versatile solution for a wide range of applications. With a temperature range of -25 to 85°C, this shift register is built to withstand even the toughest conditions. Trust Texas Instruments to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection for the internal components of the shift register, ensuring long-term reliability.

No. of Functions: 2

Having 2 functions allows for versatile usage and increased functionality in different digital circuit applications.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate the shift register into existing circuit designs, saving space and improving overall layout efficiency.

No. of Bits: 133

With 133 bits, this shift register can handle a large amount of data processing, making it suitable for complex digital systems.

No. of Terminals: 16

Having 16 terminals allows for easy connection to other components, facilitating seamless integration into digital circuits.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to mount the shift register on a circuit board and ensures a neat and organized layout.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this shift register can withstand high temperatures, making it suitable for various industrial applications.

Minimum Operating Temperature: -25 °C

The shift register can still function at low temperatures down to -25 °C, ensuring reliability in different environmental conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in connection options, allowing for different wiring configurations to suit specific design requirements.

Technology: MOS

MOS technology offers high-speed operation and low power consumption, making this shift register energy-efficient and ideal for digital applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals are easy to solder onto a PCB, ensuring secure connections and reliable performance in the circuit.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, this shift register is compatible with commonly used connectors and sockets, simplifying installation and maintenance.

Technical Specifications

Digital Shift Registers TMS3113NC attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Bits:

133

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3113NC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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