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MC74HC165ADTR2

Onsemi

MC74HC165ADTR2 by Onsemi

MC74HC165ADTR2 by Onsemi is an 8-bit digital shift register with a propagation delay of 225ns. It operates at a supply voltage range of 2-6V and has a max frequency of 20MHz. Ideal for military-grade applications requiring fast data shifting in compact spaces due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,600 parts In-Stock

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Digiode

USA . 707 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Ampacity Inc.

Singapore . 659 parts In-Stock

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$18.000

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AZTECH Wire

Italy . 540 parts In-Stock

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$18.373

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Component Stockers USA

USA . 553 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 5,665 parts In-Stock

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SupplyDigital Components

Austria . 3,628 parts In-Stock

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Argo Parts USA

USA . 3,556 parts In-Stock

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Problanco Electronics

Mexico . 2,602 parts In-Stock

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TANS Electronics

Latvia . 2,420 parts In-Stock

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Kulean Microsystems

USA . 2,396 parts In-Stock

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Corphita

USA . 1,145 parts In-Stock

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UHIMA Technologies

Türkiye . 498 parts In-Stock

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Corohmni

South Africa . 448 parts In-Stock

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Microchip USA

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Aranea Global

USA . 100 parts In-Stock

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Overview

Enhance your digital circuit designs with the MC74HC165ADTR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products like this 8-bit digital shift register known for its reliability and efficiency. Ideal for applications requiring precise data transfer, this product offers customers a seamless experience with its fast propagation delay of 225ns and versatile trigger type. Upgrade your projects with the MC74HC165ADTR2 and unlock a world of possibilities in digital electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

No. of Bits: 8

Ideal for applications requiring 8-bit shift register functionality.

Nominal Supply Voltage / Vsup (V): 3

Optimal voltage for stable operation.

Propagation Delay (tpd): 225 ns

Low propagation delay ensures fast data transfer.

Trigger Type: POSITIVE EDGE

Allows for precise data transfer triggering.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Digital Shift Registers MC74HC165ADTR2 attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

24 MHz

Trade Compliance

MC74HC165ADTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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