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TMS3132NC

Texas Instruments

TMS3132NC by Texas Instruments

TMS3132NC by Texas Instruments is a digital shift register with 144 bits and 8 terminals. It operates b/w -25°C to 85°C, suitable for various applications. The package style is in-line rectangular made of plastic/epoxy, ideal for MOS technology circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,676 parts In-Stock

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8,676

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Digiode

USA . 1,716 parts In-Stock

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1,716

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ComSIT Distribution GmbH

Germany . 400 parts In-Stock

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400

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ComSIT USA

USA . 400 parts In-Stock

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400

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Manoshevitz Elec. Sales

Israel . 6 parts In-Stock

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6

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ECAB

Sweden . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 358 parts In-Stock

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$6.816

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358

$6.816

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Parana Technologies

USA . 1,421 parts In-Stock

1+ parts

$11.049

100+ parts

$1,026.100

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$9.944

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1,421

$11.049

$1,026.100

$9.944

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DigiPath Technology Company

USA . 663 parts In-Stock

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$12.167

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663

$12.167

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ChromeModa Solutions

Germany . 6,717 parts In-Stock

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$12.415

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$10.180

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6,717

$12.415

$10.180

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IDEA Electronic Components Group

UK . 1,055 parts In-Stock

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$12.415

100+ parts

$11.794

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$11.174

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1,055

$12.415

$11.794

$11.174

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One Stop Electronics

USA . 1,137 parts In-Stock

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$27.000

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1,137

$27.000

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Corphita

USA . 4,142 parts In-Stock

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Assy Fe

Spain . 5 parts In-Stock

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Overview

Unlock the power of digital shift registers with the TMS3132NC from Texas Instruments. With a reputation for superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact PLASTIC/EPOXY package. Ideal for a range of applications, this product boasts 144 bits across 2 functions, providing unmatched performance. Whether you're looking to streamline your operations or enhance your designs, the TMS3132NC offers unbeatable value, benefits, and advantages that will take your projects to the next level. Experience innovation at its finest with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

No. of Functions: 2

Having 2 functions allows for versatility and flexibility in functionality.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into existing circuit designs and layouts.

No. of Bits: 144

With 144 bits, this shift register can handle a large amount of data, suitable for complex applications.

No. of Terminals: 8

Having 8 terminals allows for easy connectivity and integration with other components.

Package Style (Meter): IN-LINE

In-line package style makes it easy to fit into tight spaces and compact designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh conditions.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows for operation in cold environments without any issues.

Terminal Position: DUAL

Dual terminal position provides additional flexibility in mounting and installation options.

Technology: MOS

MOS technology offers high-speed operation and low power consumption, making it efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminal form is easy to solder and provides a secure connection for stability.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this shift register can be easily integrated into standard PCB layouts.

Technical Specifications

Digital Shift Registers TMS3132NC attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Bits:

144

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3132NC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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