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TMS3112JC

Texas Instruments

TMS3112JC by Texas Instruments

TMS3112JC by Texas Instruments is a 32-bit digital shift register with 6 functions. It features MOS technology, operates b/w -25°C to 85°C, and has an in-line rectangular ceramic package with 24 terminals. Ideal for applications requiring precise data shifting and control in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,690 parts In-Stock

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Digiode

USA . 2,772 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 418 parts In-Stock

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$13.753

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418

$13.753

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Parana Technologies

USA . 966 parts In-Stock

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$17.808

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$17.987

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966

$17.808

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$17.987

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DigiPath Technology Company

USA . 1,824 parts In-Stock

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$19.609

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$19.609

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ChromeModa Solutions

Germany . 3,499 parts In-Stock

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$20.009

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$16.407

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3,499

$20.009

$16.407

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IDEA Electronic Components Group

UK . 1,591 parts In-Stock

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$20.009

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$19.009

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$18.008

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1,591

$20.009

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$18.008

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One Stop Electronics

USA . 1,459 parts In-Stock

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$30.000

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Corphita

USA . 4,678 parts In-Stock

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Overview

Elevate your digital shift register applications with the TMS3112JC by Texas Instruments. With a reputation for high-quality manufacturing, Texas Instruments delivers cutting-edge technology in a compact package. This 32-bit shift register offers customers unparalleled value and benefits, enhancing functionality while ensuring reliable performance. Whether you're designing industrial control systems or consumer electronics, the TMS3112JC is the perfect solution for your digital shifting needs. Trust Texas Instruments to provide the innovation and excellence you deserve.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides good heat resistance and stability, making it suitable for high temperature operating environments.

No. of Functions: 6

Having 6 functions in one device allows for more complex operations to be performed efficiently.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to integrate this shift register into various circuit designs.

No. of Bits: 32

With 32 bits, this shift register can handle a larger amount of data storage and processing compared to lower bit count devices.

No. of Terminals: 24

Having 24 terminals allows for more connections and flexibility in designing circuits with this shift register.

Package Style (Meter): IN-LINE

In-line package style makes it convenient for installation and placement in circuit boards or systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance even in harsh environmental conditions.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows for usage in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and reliability in connecting external components or circuits.

Technology: MOS

MOS technology offers high speed and low power consumption, ideal for efficient data processing and storage.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures secure and stable connections with external components or PCBs.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm allows for easy integration and compatibility with common PCB layouts and components.

Technical Specifications

Digital Shift Registers TMS3112JC attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

No. of Bits:

32

No. of Functions:

6

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3112JC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-041-1489, 5962010411489

NIIN

010411489

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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