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TMS3103NC

Texas Instruments

TMS3103NC by Texas Instruments

TMS3103NC by Texas Instruments is a 64-bit digital shift register with 2 functions. It features a rectangular package style with 16 terminals and operates b/w -25°C to 85°C. Ideal for MOS technology applications requiring precise data shifting in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,403 parts In-Stock

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4,403

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Digiode

USA . 309 parts In-Stock

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309

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Distributors (Availability)

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AZTECH Wire

Italy . 214 parts In-Stock

1+ parts

$10.010

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214

$10.010

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One Stop Electronics

USA . 203 parts In-Stock

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$19.000

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203

$19.000

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Parana Technologies

USA . 620 parts In-Stock

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$22.197

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$22.845

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620

$22.197

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$22.845

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DigiPath Technology Company

USA . 1,398 parts In-Stock

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$24.442

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1,398

$24.442

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ChromeModa Solutions

Germany . 6,596 parts In-Stock

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$24.941

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$20.452

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6,596

$24.941

$20.452

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IDEA Electronic Components Group

UK . 323 parts In-Stock

1+ parts

$24.941

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$23.694

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$22.447

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323

$24.941

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$22.447

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Corphita

USA . 4,399 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the TMS3103NC by Texas Instruments, a leading manufacturer in the industry. As a digital shift register with 64 bits and 16 terminals, this product offers exceptional performance and versatility for a wide range of applications. Whether you're working on automation, communication systems, or data processing, the TMS3103NC provides value, efficiency, and ease of use, making it the ideal choice for your next project. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the shift register suitable for various applications.

No. of Functions: 2

Having 2 functions allows for more complex operations and versatility in processing data within the shift register.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate the shift register into different electronic circuits and designs.

No. of Bits: 64

64 bits provide a high level of precision and accuracy in data processing and storage.

No. of Terminals: 16

With 16 terminals, there are sufficient connection points for interfacing with other components and devices.

Package Style (Meter): IN-LINE

In-line package style allows for compact placement on circuit boards and enables efficient use of space.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in a wide range of operating conditions.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows for operation in cold environments without performance degradation.

Terminal Position: DUAL

Dual terminal position provides flexibility in connecting the shift register to external devices from multiple directions.

Technology: MOS

MOS technology offers high-speed performance and low power consumption, making the shift register energy-efficient.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and ease of soldering during the assembly process.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm ensures compatibility with common electronic components and facilitates easy PCB layout.

Technical Specifications

Digital Shift Registers TMS3103NC attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Bits:

64

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3103NC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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