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74HC594DB

NXP Semiconductors

74HC594DB by NXP Semiconductors

SERIAL IN PARALLEL OUT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,703 parts In-Stock

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Anansix

USA . 2,354 parts In-Stock

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Digiode

USA . 1,173 parts In-Stock

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VNN

France . 793 parts In-Stock

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Nova Conductors

Japan . 92 parts In-Stock

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ECAB

Sweden . 51 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 430 parts In-Stock

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$4.000

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$3.900

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$3.880

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430

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Ampacity Inc.

Singapore . 1,536 parts In-Stock

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AZTECH Wire

Italy . 14,410 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,451 parts In-Stock

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One Stop Electronics

USA . 1,243 parts In-Stock

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$47.000

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UNI Independent Distributors

Spain . 6,407 parts In-Stock

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Lixinc

USA . 5,267 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Corphita

USA . 1,568 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,000 parts In-Stock

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Glotronic Ltd.

UK . 800 parts In-Stock

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Continental Prestige Electronics

USA . 796 parts In-Stock

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Advanced Electronics

New Zealand . 300 parts In-Stock

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Supply Digital

USA . 248 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Technical Specifications

Digital Shift Registers 74HC594DB attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Additional Features:

PARALLEL OUTPUT IS REGISTERED; UNREGISTERED SERIAL SHIFT RIGHT OUTPUT

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

24 MHz

Trade Compliance

74HC594DB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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