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TMS3016LR

Texas Instruments

TMS3016LR by Texas Instruments

TMS3016LR by Texas Instruments is a 16-bit digital shift register with MOS technology. It has 10 terminals in a round cylindrical package made of metal, operating b/w -55°C to 85°C. Ideal for applications requiring serial data transfer and storage in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,585 parts In-Stock

1+ parts

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8,585

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Digiode

USA . 4,530 parts In-Stock

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4,530

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$7.761

100+ parts

-

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283

$7.761

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Parana Technologies

USA . 290 parts In-Stock

1+ parts

$27.697

100+ parts

-

1k+ parts

$38.905

10k+ parts

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290

$27.697

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$38.905

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DigiPath Technology Company

USA . 963 parts In-Stock

1+ parts

$30.498

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963

$30.498

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IDEA Electronic Components Group

UK . 271 parts In-Stock

1+ parts

$31.120

100+ parts

$29.564

1k+ parts

$28.008

10k+ parts

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271

$31.120

$29.564

$28.008

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ChromeModa Solutions

Germany . 69 parts In-Stock

1+ parts

$31.120

100+ parts

$25.518

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69

$31.120

$25.518

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One Stop Electronics

USA . 264 parts In-Stock

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$47.000

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264

$47.000

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Corphita

USA . 3,502 parts In-Stock

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3,502

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Overview

Transform your digital shift register experience with the TMS3016LR by Texas Instruments. Known for their superior quality and expertise in semiconductor manufacturing, Texas Instruments delivers a reliable and efficient product that exceeds industry standards. Ideal for applications requiring precise data storage and manipulation, this 16-bit shift register offers unparalleled performance and flexibility. Unlock the potential of your designs with the TMS3016LR and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: METAL

Metal packaging provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Functions: 2

Having multiple functions allows for versatile use and integration in various systems or circuits.

Package Shape: ROUND

Round shape can make it easier for installation and integration in certain setups, offering a space-saving design.

No. of Bits: 16

With 16 bits, this shift register can handle a larger amount of data, making it suitable for applications requiring higher precision or data processing.

No. of Terminals: 10

Having 10 terminals allows for more connectivity options and flexibility in designing circuits or systems.

Package Style (Meter): CYLINDRICAL

Cylindrical package style can make it easy to mount and secure the shift register in place, enhancing usability and functionality.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in various environmental conditions, making it suitable for industrial or outdoor use.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for use in extreme cold conditions without compromising functionality or performance.

Terminal Position: BOTTOM

Bottom terminal position can make it convenient for connecting the shift register to other components or circuits, enhancing ease of use and installation.

Technology: MOS

MOS technology offers high speed and efficiency, making this shift register suitable for applications requiring fast data processing and low power consumption.

Terminal Form: WIRE

Wire terminals provide a secure and reliable connection, reducing the risk of loose connections or signal interference in the circuit.

Technical Specifications

Digital Shift Registers TMS3016LR attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

O-MBCY-W10

No. of Bits:

16

No. of Functions:

2

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

METAL

Package Equivalence Code:

CAN10,.23

Package Shape:

Package Style (Meter):

CYLINDRICAL

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

TMS3016LR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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