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TMS3101NC

Texas Instruments

TMS3101NC by Texas Instruments

TMS3101NC by Texas Instruments is a digital shift register with 100 bits and 16 terminals. It operates b/w -25°C to 85°C, using MOS technology in an in-line package style. Ideal for applications requiring dual terminal positions and made of plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,036 parts In-Stock

1+ parts

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100+ parts

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8,036

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Digiode

USA . 728 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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728

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ACDS - Activité Composants Distribution Service

France . 38 parts In-Stock

1+ parts

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38

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,310 parts In-Stock

1+ parts

$10.917

100+ parts

$1,013.785

1k+ parts

$9.825

10k+ parts

-

1,310

$10.917

$1,013.785

$9.825

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DigiPath Technology Company

USA . 1,355 parts In-Stock

1+ parts

$12.021

100+ parts

-

1k+ parts

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1,355

$12.021

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AZTECH Wire

Italy . 515 parts In-Stock

1+ parts

$12.043

100+ parts

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515

$12.043

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ChromeModa Solutions

Germany . 6,929 parts In-Stock

1+ parts

$12.266

100+ parts

$10.058

1k+ parts

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10k+ parts

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6,929

$12.266

$10.058

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IDEA Electronic Components Group

UK . 1,141 parts In-Stock

1+ parts

$12.266

100+ parts

$11.653

1k+ parts

$11.039

10k+ parts

-

1,141

$12.266

$11.653

$11.039

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One Stop Electronics

USA . 1,033 parts In-Stock

1+ parts

$29.000

100+ parts

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1,033

$29.000

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Corphita

USA . 750 parts In-Stock

1+ parts

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750

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Overview

Upgrade your digital shift register experience with the TMS3101NC by Texas Instruments. With a reputation for high-quality manufacturing, Texas Instruments delivers a superior product that boasts 100 bits and 16 terminals in a sleek rectangular package. Perfect for a range of applications, this innovative technology offers customers unmatched value, benefits, and advantages. Discover the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product.

No. of Functions: 2

Having multiple functions allows for versatile use in different applications.

Package Shape: RECTANGULAR

The rectangular shape helps in easy integration and placement in electronic circuits.

No. of Bits: 100

With 100 bits, this product can handle a large amount of data processing efficiently.

No. of Terminals: 16

Having 16 terminals enables easy connections to other components in the circuit.

Package Style (Meter): IN-LINE

The in-line package style allows for space-saving and organized circuit layout.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand heat in various environments.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Position: DUAL

Dual terminal position offers flexibility in connectivity options.

Technology: MOS

MOS technology ensures efficient operation and low power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and stable connections in the circuit.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy soldering and alignment with standard PCB layouts.

Technical Specifications

Digital Shift Registers TMS3101NC attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Bits:

100

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS3101NC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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