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74LV4094D

NXP Semiconductors

74LV4094D by NXP Semiconductors

NXP Semiconductors' 74LV4094D is an 8-bit digital shift register with a propagation delay of 90ns. Operating at a supply voltage of 3.3V, it features positive edge triggering and true output polarity. Ideal for automotive applications, this CMOS technology-based IC has a max operating temperature of 125°C and is surface-mountable in a small outline package.

Median Price

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Lifecycle Status

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6

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Vyrian

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Nova Conductors

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One Stop Electronics

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AZTECH Wire

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Ampacity Inc.

Singapore . 1,572 parts In-Stock

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Continental Prestige Electronics

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Overview

Unlock the possibilities with the NXP Semiconductors 74LV4094D digital shift register. Designed with precision and reliability in mind, this product offers seamless integration for a variety of applications. Whether you're looking to enhance your automotive electronics or streamline your industrial processes, this high-quality component delivers unparalleled performance. Trust NXP Semiconductors to provide innovative solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the shift register.

Surface Mount: YES

Enables easy and efficient mounting on circuit boards.

No. of Bits: 8

Offers a sufficient number of bits for various digital applications.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common voltage standards, ensuring easy integration into systems.

Propagation Delay (tpd): 90 ns

Provides fast signal processing performance.

Output Characteristics: 3-STATE

Allows for high impedance state output, increasing flexibility in signal routing.

Technology: CMOS

Utilizes CMOS technology which offers low power consumption and high noise immunity.

Technical Specifications

Digital Shift Registers 74LV4094D attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Additional Features:

SISO OPERATION ALSO AVAILABLE

Count Direction:

RIGHT

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

90 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

20 MHz

Trade Compliance

74LV4094D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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