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SN74HC323J

Texas Instruments

SN74HC323J by Texas Instruments

SN74HC323J by Texas Instruments is an 8-bit digital shift register with a supply voltage of 5V. It features CMOS technology, operates in industrial temperature range (-40 to 85°C), and has 20 terminals in an in-line package. Ideal for applications requiring serial-to-parallel data conversion and signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,402 parts In-Stock

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4,402

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Digiode

USA . 1,006 parts In-Stock

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1,006

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,544 parts In-Stock

1+ parts

$15.164

100+ parts

-

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$15.564

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1,544

$15.164

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$15.564

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AZTECH Wire

Italy . 508 parts In-Stock

1+ parts

$15.751

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508

$15.751

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DigiPath Technology Company

USA . 576 parts In-Stock

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$16.697

100+ parts

$15.361

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576

$16.697

$15.361

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ChromeModa Solutions

Germany . 5,161 parts In-Stock

1+ parts

$17.038

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$13.971

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5,161

$17.038

$13.971

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IDEA Electronic Components Group

UK . 436 parts In-Stock

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$17.038

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$16.186

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$15.334

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436

$17.038

$16.186

$15.334

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One Stop Electronics

USA . 774 parts In-Stock

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$33.000

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774

$33.000

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Corphita

USA . 3,422 parts In-Stock

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Overview

Unlock the power of seamless data transfer with the Texas Instruments SN74HC323J digital shift register. Crafted with precision and expertise, this innovative product offers unparalleled quality and reliability. Ideal for a wide range of applications, this shift register is designed to streamline your processes and enhance efficiency. Experience the value of superior performance and versatility, all in one compact package. Upgrade your technology with Texas Instruments and discover the endless possibilities that await you.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides durability and reliability, making the product suitable for use in industrial environments.

No. of Bits: 8

With 8 bits, this shift register can handle moderate amounts of data processing efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems and devices.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures up to 85°C, making it suitable for industrial applications where heat may be a concern.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation and reliable data processing.

Technical Specifications

Digital Shift Registers SN74HC323J attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74HC323J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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