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TLK2211RCPRG4

Texas Instruments

TLK2211RCPRG4 by Texas Instruments

TLK2211RCPRG4 by Texas Instruments is an Ethernet transceiver with a data rate of 1300 Mbps, operating at 3.3V. It features a flatpack package style, Gull Wing terminal form, and operates in industrial temperature grades. Ideal for network interfaces requiring high-speed data transmission in various applications.

Median Price

$8.352

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$8.352

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Vyrian

USA . 9,349 parts In-Stock

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Digiode

USA . 680 parts In-Stock

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680

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Distributors (Availability)

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Parana Technologies

USA . 613 parts In-Stock

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$10.011

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$10.571

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DigiPath Technology Company

USA . 348 parts In-Stock

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$11.023

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348

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ChromeModa Solutions

Germany . 2,736 parts In-Stock

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$11.248

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$9.223

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2,736

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IDEA Electronic Components Group

UK . 1,281 parts In-Stock

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$11.248

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$10.686

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$10.123

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AZTECH Wire

Italy . 698 parts In-Stock

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$16.357

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Component Stockers USA

USA . 647 parts In-Stock

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$99.990

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One Stop Electronics

USA . 1,373 parts In-Stock

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$265.000

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Semicontronic

India . 501 parts In-Stock

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$633.000

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$617.175

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$614.010

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Ampacity Inc.

Singapore . 793 parts In-Stock

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$813.000

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Corphita

USA . 4,524 parts In-Stock

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Microchip USA

USA . 4,440 parts In-Stock

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Corohmni

South Africa . 262 parts In-Stock

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Overview

Enhance your network communications with the TLK2211RCPRG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions in the Network Interfaces category. This Ethernet transceiver offers fast data rates of up to 1300 Mbps, making it ideal for industrial applications. With a low supply current of just 0.23 mA and a wide operating temperature range, this component provides excellent value and performance for your networking needs. Trust Texas Instruments for cutting-edge technology that ensures seamless connectivity and efficiency in your systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the network interface lightweight and durable, ideal for high-performance applications.

Surface Mount: YES

Being surface mountable makes installation of the network interface easy and convenient, saving space on the circuit board.

Power Supplies (V): 3.3

The 3.3V power supply requirement ensures efficient power consumption and compatibility with a wide range of systems.

No. of Terminals: 64

With 64 terminals, this network interface can handle a high volume of data transfer and communication channels, suitable for complex networking tasks.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the network interface to perform reliably even in challenging environmental conditions.

Technology: CMOS

The CMOS technology used in this network interface enables efficient power usage, high-speed data processing, and low noise operation.

Data Rate: 1300 Mbps

With a data rate of 1300 Mbps, this network interface can provide high-speed and reliable data transmission, making it suitable for demanding networking applications.

Technical Specifications

Network Interfaces TLK2211RCPRG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1300 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.23 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2211RCPRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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