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TLK2201ARCPG4

Texas Instruments

TLK2201ARCPG4 by Texas Instruments

TLK2201ARCPG4 by Texas Instruments is an Ethernet transceiver with a data rate of 1600 Mbps. It operates at 2.5V and has a max supply current of 0.111 mA. This network interface IC is designed for commercial temperature grade applications, featuring a quad terminal position and Gull Wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,010 parts In-Stock

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3,010

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Digiode

USA . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 442 parts In-Stock

1+ parts

$8.196

100+ parts

-

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$8.806

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442

$8.196

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$8.806

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DigiPath Technology Company

USA . 1,429 parts In-Stock

1+ parts

$9.025

100+ parts

$8.303

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1,429

$9.025

$8.303

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IDEA Electronic Components Group

UK . 1,537 parts In-Stock

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$9.209

100+ parts

$8.749

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$8.288

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1,537

$9.209

$8.749

$8.288

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ChromeModa Solutions

Germany . 666 parts In-Stock

1+ parts

$9.209

100+ parts

$7.551

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666

$9.209

$7.551

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AZTECH Wire

Italy . 385 parts In-Stock

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$11.462

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385

$11.462

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Component Stockers USA

USA . 540 parts In-Stock

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$99.990

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540

$99.990

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One Stop Electronics

USA . 1,229 parts In-Stock

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$913.000

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$913.000

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Microchip USA

USA . 4,716 parts In-Stock

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4,716

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Corphita

USA . 1,806 parts In-Stock

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1,806

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Kepictronics

USA . 120 parts In-Stock

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Overview

Experience unmatched performance and reliability with the TLK2201ARCPG4 by Texas Instruments, a leading manufacturer in the industry. This Ethernet transceiver offers seamless connectivity for network interfaces, making it ideal for a wide range of applications. With its state-of-the-art technology and high-quality materials, this product ensures optimal functionality and efficiency. Say goodbye to slow connections and hello to smooth, fast data transfers with the TLK2201ARCPG4. Upgrade your network today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable devices or applications where weight is a concern.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 2.5

The low power supply voltage of 2.5V ensures energy efficiency, reducing power consumption and heat generation, making it suitable for battery-operated devices.

No. of Terminals: 64

With a high number of terminals, this product allows for a greater amount of data transfer and connectivity options, making it versatile and suitable for complex networking applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures the product can perform reliably even in harsh environmental conditions, increasing its durability and longevity.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high speed, and compatibility with various systems, making it a reliable and efficient choice for networking applications.

Data Rate: 1600 Mbps

The high data rate of 1600 Mbps enables fast and efficient data transfer, ensuring smooth and reliable networking performance for demanding applications.

Technical Specifications

Network Interfaces TLK2201ARCPG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1600 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.111 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2201ARCPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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