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TLK2201BRCPG4

Texas Instruments

TLK2201BRCPG4 by Texas Instruments

TLK2201BRCPG4 by Texas Instruments is an Ethernet transceiver with a data rate of 1600 Mbps. It operates at 2.5V and has a terminal pitch of 0.5mm, suitable for network interfaces in commercial-grade applications. The package style includes a flatpack with very thin profile and fine pitch terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,825 parts In-Stock

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Digiode

USA . 2,460 parts In-Stock

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Bristol Electronics

USA . 8 parts In-Stock

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8

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Distributors (Availability)

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AZTECH Wire

Italy . 701 parts In-Stock

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$11.646

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701

$11.646

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Parana Technologies

USA . 2,211 parts In-Stock

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$11.728

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$12.123

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2,211

$11.728

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$12.123

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DigiPath Technology Company

USA . 1,774 parts In-Stock

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$12.914

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$11.881

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1,774

$12.914

$11.881

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ChromeModa Solutions

Germany . 1,951 parts In-Stock

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$13.178

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$10.806

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1,951

$13.178

$10.806

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IDEA Electronic Components Group

UK . 215 parts In-Stock

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$13.178

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$12.519

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$11.860

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215

$13.178

$12.519

$11.860

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Semicontronic

India . 1,644 parts In-Stock

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$259.000

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$252.525

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$251.230

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1,644

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One Stop Electronics

USA . 516 parts In-Stock

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$856.000

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Lixinc

USA . 1,505 parts In-Stock

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Corohmni

South Africa . 473 parts In-Stock

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Corphita

USA . 433 parts In-Stock

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Overview

Experience high-quality networking solutions with the TLK2201BRCPG4 by Texas Instruments. Known for their reliability and innovation, Texas Instruments delivers top-notch network interfaces that cater to a wide range of applications. From Ethernet transceivers to data rates of up to 1600 Mbps, this product offers customers unparalleled value, benefits, and advantages. Stay connected and maximize efficiency with the TLK2201BRCPG4 - the ultimate networking solution for your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and space in the design.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliability in various settings.

Data Rate: 1600 Mbps

The high data rate of 1600 Mbps ensures fast and efficient data transmission, making it suitable for high-performance network applications.

Technical Specifications

Network Interfaces TLK2201BRCPG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1600 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.111 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2201BRCPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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